2835 03W 3芯暖白串联规格书(26-30LM)

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1、广州市新弘茂光源科技有限公司廣東省廣州市荔灣區芳村東沙荷景路9號（東朗工業園）2棟201電話:+86-20-8140279881414708傳真:81402027E-mail:xhm@xhm-led.comSMDLEDPRODUCTSPCIFICATIONDESCRIPTION2835SinglechipWhitesmdled(0.3W)CUSTOMERDATEREVv1.0PREPAREDCHECKAPPROVEDLumenMaxCustomerRevisionNoteDateRevisionPageVision2013/

2、08/18InitiateDocument2~11V1.01.Features?SamllSize(2.8*3.5*0.8mm)?IndustryStandardFootprint?HighEfficiency?Pb-Free?Solderingmethods:IRreflowsoldering?ChipDice:InGaN3.502.Dimensions0.803.3022.101211.902.100.250.602.002.602.80CathodemarkUnit:mmTolerance:±0.1mm3.Reconn

3、endedSolderingPattern(Units:mm)2.502.500.604.002.104.TypicalElectrical&OpticalCharacteristics(Ta=25°)ItemsSymbolConditionDeviceMin.Typ.Max.UnitForwardvoltageVFIF=30mA9---10.5VReverseCurrentIRVR=15V------10μAColortemperatureTCIF=30mA290030503200KLuminousFlux¢VIF=30m

4、A262830LMViewAngle2θ1/2IF=30mA---120---Notes:1.LuminousIntensity:+/-10%2.ForwardVoltage:+/-0.1V.5.AbsoluteMaxinumRatingsat(Ta=25°)ParameterRatingUnitsPowerdissipation360mWDCForwardCurrent30mAPeakForwardCurrent[1]100mAReverseVoltage5VOperatingTemperature-40°CTo+85°C

5、StorageTemperature-40°CTo+85°CNote:1.1/10DutyCycle,0.1msPulseWidth.9.Reflowprofile■Temperature-profile(Surfaceofcircuitboard)1.Reflowsolderingshouldnotbedonemorethantwotimes2.Whensoldering,donotputstressontheLEDsduringheating10.PackagingSpecificatio●FeedingDirectio

6、n●DimensionsofReel(Unit:mm)●Reel3000PCSA8.0mmB178.0mmC60.0mmD13.0mm●DimensionsofTape(Unit:mm)11.Packagingspecifications