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1、第15页共15页精密锡膏印刷机Page15of15PrecisionStencilPrintingMachine半自动锡膏印刷机Semi-AutomaticStencilPrintingMachine锡膏印刷机StencilPrintingMachine使用说明书InstructionManual第15页共15页精密锡膏印刷机Page15of15PrecisionStencilPrintingMachine电气控制面板K-01ElectricalControlPanelK-01123541.准备按钮11.Prep
2、arationbutton12.电源按钮2.Powerbutton3.印刷速度电位器3.Printingspeedpotentiometer4.触摸屏4.Touchpanel5.准备按钮25.Preparationbutton2第15页共15页精密锡膏印刷机Page15of15PrecisionStencilPrintingMachine叁:本机操作及控制要领III.InstructionaboutOperationandControlofThisDevice一.机台原点确认I.Confirmationofequ
3、ipmentorigin开机后原点自我确认,成立条件(S1,S3)或(S1,S4)Theoriginisselfconfirmedafterpoweringon,withthetenableconditionof(S1,S3)or(S1,S4).二.归零设定要领II.InstructionaboutZeroing首先钢网模板夹臂8个五星把手螺丝压紧钢网模板,将机体下降至S2下始点.把PCB放于台板上转动印刷机顶部之升降手轮,依PCB厚度调节钢网模板与印刷台板之间距离.(上钢网模板前确认机体下降至S2与印刷台板之间
4、距离>PCB高度,否则会出钢网模板或机台受损;测量方法:目测)First,tightlycompressthe8five-pointedstarknobsonthecliparmofthesteelmeshmoldingboardwiththesteelmeshmoldingboard,lowerthemachinebodytothelowerinitialpointS2.PlacePCBonthebedplate,rotatethetopoftheprintingmachinetoliftthehandwhee
5、ltoadjustthedistancebetweenthesteelmeshmoldingboardandtheprintingbedplateinaccordancewiththePCBthickness.(confirmthatthemachinebodygoesdowntoS2andthedistancewiththeprintingbedplate>PCBheight,orthesteelmeshmoldingplateorthebedplatewillbedamaged;themeasurementm
6、ethod:visual)三.支撑PIN设定方式:III.SupportingPINSettingMode本机之定位PIN可移动请依钢网模板之图形概略将支撑PIN放于台板适中位置;ThepositioningPINofthisdeviceismovable,pleaseplacethesupportingPINinaproperpositiononthebedplateinaccordancewiththesketchdiagramofthesteelmeshmoldingplate.四.对网设定方式IV.Mes
7、hCalibrationSettingMode完成上述动作后,再进行印刷钢网模板与印刷PCB校对方法如下:将PCB放于支撑PIN上,并用定位PIN定位牢固,(至少定位PCB三点),放于钢网模板与PCB对准焊盘,之后移动钢网夹臂将钢网夹牢,再到PCB台板之X、Y调节螺栓进行调校微调.对好位置后再把台板下的锁紧螺丝拧紧.方可进行批量印刷。Whentheaboveactionsaredone,calibratetheprintingsteelmeshmoldingplateandtheprintingPCB,andth
8、emethodisasfollows:placePCBonthesupportingPINandpositionandfastenitwiththepositioningPIN.(AtleastthreepointsofPCBshallbepositioned),placethesteelmeshmoldingplate第15页共15页精密锡膏印刷机Page15of15P