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1、ManagingheatforelectronicsbyPatrickK.Schelling1,*,LiShi2,andKennethE.Goodson3IncreasingpowerdensitiesanddecreasingtransistorThermalmanagementiswidelyrecognizedtobeandimensionsarehallmarksofmoderncomputerchips.importantaspectofcomputerdesign,withdeviceB
2、othtrendsareincreasingthethermalmanagementperformancebeingsignificantlyaffectedbytemperature.Inaddition,devicelifetimecanbechallengewithinthechipandsurroundingpackaging,decreaseddrasticallybecauseoflargethermalaswellasacceleratingresearchprogressonhigh
3、-stressesthatoccurespeciallyatinterfaces.Theconductivitymaterials.Thisarticlereviewsrecentabilityofastructuretoremoveheatisbestmaterialsadvanceswithafocusonnovelcompositequantifiedbyitsthermalresistance,whichisgivenbysubstratesandinterfacematerials,inc
4、ludingthosethetemperaturedifferencedividedbyinputpower.compositesleveragingthehighconductivitiesofInmicroprocessordesign,theallowabletemperaturecarbonnanotubes.Furthermore,attentionisgiventodropbetweenthetransistor(wheremostoftheheatthespecialpropertie
5、sofone-dimensionalstructuresisgenerated)andtheambientairisconstant.Asaresult,thechallengeforthermalmanagementistothatarelikelytobeofincreasingimportanceindevelophigh-conductivitystructuresthatcanfutureapplications.accommodatethisfixedtemperaturedropwit
6、htheincreasingpowerdensitiesthatcharacterizenewgenerationsofmicroprocessors.Fig.1showsthekeycomponentsthatcontributetothethermalresistanceofamicroprocessordevice.First,heatmusttraversethechipandheatspreader,whereaportionof1AdvancedMaterialsProcessingan
7、dAnalysisCenter,theallowabletemperaturedropoccurs.Second,theheatsinkandDepartmentofPhysics,conductsheatawayfromtheactiveregions.UniversityofCentralFlorida,OrlandoFL,32816,USAThreedrivingforcesareplacingstringentdemandson*E-mail:pschell@mail.ucf.edumate
8、rialsforthermalmanagement.First,thedriveto2DepartmentofMechanicalEngineeringandCenterforNanoandMolecularScienceandTechnology,improvespeedmotivatescircuitdesignerstocompresstheTexasMaterialsInstitute,‘core’ofthemicroprocessor,whichcontai
