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1、HeatSinkDesignforaThermoelectricCoolingSystemab*accccHunSikHan,SeoYoungKim,TaeHoJi,Young-JunJee,DaewoongLee,KilSangJang,DongHoonOhaDepartmentofMechanicalEngineering,KoreaAdvancedInstituteofScienceandTechnology,Daejeon305-701,Koreab*EnergyMechanicsResearchCenter,K
2、oreaInstituteofScienceandTechnology,Seoul136-791,KoreaEmail:seoykim@kist.re.krcAdvancedEngineeringTeam,HallaClimateControlCorporation,Daejeon306-239,KoreaABSTRACTNnumberofcouplesinTEMNuNusseltnumberThermalperformanceoflouverfin,offsetstripfinandPinputpowerofTEM,W
3、eplatefininathermoelectriccoolingsystemwithaduct-flow3Qairflowrate,m/stypefanarrangementisanalyticallyexamined.Thethermoelectriccoolingsystemiscomposedofawaterjacket,QcheatabsorbedatthecoldsideofTEM,Wanarrayofthermoelectricmodulesandaheatsink.HeatsinksQheatdissip
4、atedatthehotsideofTEM,Whwithdimensionof39.7mm119.1mmplaneareaand40mmRelectricalresistanceofcouple,ȳdfinheightareconsideredfortheperformancecomparison.InRconvectivethermalresistance,K/Wordertoestimatethebaseplatetemperatureoftheheatsink,cvthethermalperformanceofa
5、thermoelectricmodule(FerroReReynoldsnumberTec:TE9500-127-060B)istakenintoaccount.FromtheTctemperatureofthecoldsideofTEM,KColburnjfactorcorrelationsforlouverfinsandoffsetstripTtemperatureofthehotsideofTEM,KhfinsandtheNusseltnumbercorrelationforplatefinheatsinks,Ti
6、nletairtemperature,Ktheconvectivethermalresistancesofheatsinksareevaluatediatthedeterminedoperatingairvelocity.ThethermalTwbaseplatesurfacetemperature,KperformanceofTEMwiththecalculatedconvectivethermalUfrontalvelocityofair,m/sresistanceisevaluated.Theresultsshow
7、thattheVinputvoltage,VthermoelectriccoolingsystemwithoptimizedplatefinheatWwidthofheatsink,mmsinkprovides24.4%higherCOP(coefficientofperformance)and27.7%higherheatabsorbedcomparedtotheoptimizedGreeksymbolslouverfinheatsink,respectively.TheoptimizedoffsetstripSee
8、beckcoefficientofcouple,V/KfinheatsinkshowsaslightlyhigherCOPandheatabsorbedPpressuredrop,Pathantheoptimizedplatefinheatsink.However,theoptimizedTtemperature
