LED封装结构及其技术

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1、本科毕业论文题目：LED封装结构及其技术院（部）：理学院专业：应用物理学班级：光电054姓名：李淑青学号：2005121108指导教师：赵俊卿张宝金完成日期：2009年6月1日I山东建筑大学毕业论文目录摘要······································································IVABSTRACT·······························································Ⅳ1前言·

2、···································································11.1关于发展半导体照明的重要性···············································11.2LED的发光原理、特点、分类及应用·········································21.2.1LED的发光原理············································

3、·····················21.2.2LED光源的基本特征····························································31.2.3LED光源的分类·································································51.2.4LED光源的应用VII山东建筑大学毕业论文················································

4、·················61.3LED封装的基本问题····················································62LED封装技术的研究现状·················································82.1引言·····································································82.2LED封装形式的演变、封装工艺流程、封装材料····

5、····························82.2.1LED封装形式的演变·····························································82.2.2LED封装工艺流程······························································102.2.3LED封装材料·······················································

6、············122.3产品封装结构类型························································132.3.1引脚式封装·····························································132.3.2表面贴装封装VII山东建筑大学毕业论文··························································152.3.3功率型封装·

7、···························································162.3.4食人鱼LED的封装······················································172.4LED封装结构的光学模拟与设计···················································192.4.1雷曼某大功率LED的模拟································

8、······················192.4.2LED的光学设计································································203LED封装技术的发展趋势················································283.1LED芯片效率的提升对芯片面积的影响·······································283.2LED器件效率与封装工艺