wafer_inspection_defect英文学习材料

wafer_inspection_defect英文学习材料

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1、CharacterizationandimprovementofunpatternedwaferdefectreviewonSEMsAlanS.Parkes*,ZaneMarek**JEOLUSA,Inc.11DearbornRoad,Peabody,MA01960ABSTRACTDefectScatterAnalysis(DSA)providesafast,accuratemethodforevaluatingtherandomerrorsmadebydefectscannerswhenawaferisloaded,alig

2、ned,scanned,andunloadedmultipletimes.TheDSAtoolincludesa200mmor300mmwaferthathasaseriesofpatterneddefects;thedefectscanbelocatedbytheinspectionscannerandthepatternsdetectedeveniftherearemanyotherdefectspresent.TheDSAsoftwareanalysesmultiplescans,locatesthepatternate

3、achsiteforeveryscan,andcomparesthedistributionsofthepatternateachsitetotheaveragereportedposition,aswellastotheknownsiteposition.Plotsofthepredictedpositionsshowthescatterintermsofx,yandrotationalerrors.Thecompositeplotforallscansandsitesrepresentsafigureofmeritfort

4、hescanner.Byitself,DSAisusefulforevaluatingwhichscannermakesthesmallestsetofrandomerrors,andtheeffectsofmodifyingascannertominimizetheseerrors.Inaddition,thesoftwarealsogeneratesadefectfileinthesameformatastheinputfiles,showingtheaveragereportedpositionsforthesiteso

5、ftheprogrammeddefects.ThisfileandthewaferprovidethebestinputtotheJEOLin-fabmicroscopesfortheLMLS/SSBWAproceduresthatcorrectformost1ofthesystematicdifferencesbetweenthepredictedpositionsandthedefectpositionsasrelocatedontheSEMs.Thetoolconsistsofone200mmor300mmwaferan

6、dtheanalysissoftware,providedinbothUNIX(either9.05or10.2)andWindows2000.ThesoftwarewillacceptdefectfilesinstandardKLA,Tencor,andInspexformats.Keywords:Defectreview,Defectrelocation,Defectscannererrors,Alignmenterrors1.INTRODUCTIONOpticaldefectscannersusevarioustechn

7、iquestolocateinconsistenciesonthesurfaceofwafers,oftendebrisscatteredonthesurface,imperfectionsinthesurface,missingpattern,oraddedpattern.Althoughthescannerscanlocateverysmalldefects,theavailablemagnificationrangeisnotsufficienttoenableeasyidentificationofthedefect,

8、ifatall.Ifthepositionofadefectisrecorded,thewafercanbeloadedinanSEMandmovedtothelocationofthatdefect.WiththeavailabletoolsontheSEM,includi

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