贴片电感0603

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1、(1/3)002-03/20040722/e521_mlk0603.fmInductorsMLKSeriesMLK0603TypeForHighFrequencySMDFEATURESPRODUCTIDENTIFICATION•Supportsoperatingfrequencybandsofupto12GHzwithnomi-MLK0603L10NJTnalinductancevaluesfrom1to33nH.(1)(2)(3)(4)(5)(6)•Thegigaspiralmultilayerstructurereducesself-resona

2、ntfrequenciesandsuppressesthereductionofQvaluesingiga-hertzbandwidths.(1)Seriesname•Advancedmonolithicstructureisformedusingamultilayeringandsinteringprocesswithceramicandconductivematerialsfor(2)Dimensionshigh-frequency.06030.6×0.3mm(L×W)•Becausethepartisnon-polarized,itcanbeu

3、sedinbulkcas-setteloaders.(3)Materialcode•Completelylead-freeproductwhichcontainsnoleadinanyofthematerialsused.Supportslead-freesolderaswell.(4)Inductancevalue10N10nHAPPLICATIONSHigh-frequencycircuitsforportabletelephones,PA,Bluetooth(5)Inductancetolerancemodules,etc.S±0.3nHJ±5

4、%SHAPESANDDIMENSIONS/RECOMMENDEDPCBOARDPATTERN(6)Packagingstyle0.6±0.03TTaping(reel)0.03PACKAGINGSTYLEANDQUANTITIES±0.25to0.35PackagingstyleQuantity0.30.2to0.30.2to0.3Taping15000pieces/reel0.15±0.050.25to0.35SPECIFICATIONS0.03±Operatingtemperaturerange–55to+125°CDimensionsinmm0

5、.3Storagetemperaturerange–55to+125°C[Unitofproduct]Weight:1.0mgHANDLINGANDPRECAUTIONSRECOMMENDEDREFLOWSOLDERINGCONDITIONS•Beforesoldering,besuretopreheatcomponents.EUTECTICSOLDERINGThepreheatingtemperatureshouldbesetsothatthetempera-turedifferencebetweenthesoldertemperatureandp

6、roducttemperaturedoesnotexceed150°C.10smax.230˚C•Aftermountingcomponentsontotheprintedcircuitboard,donot200˚Capplystressthroughboardbendingormishandling.Naturalcooling•Whenhandsoldering,applythesolderingirontotheprintedcir-150˚C40smax.cuitboardonly.Temperatureoftheirontipshould

7、notexceed60to120smax.260°C.Solderingtimeshouldnotexceed3seconds.Time(s)LEAD-FREESOLDERING240to250˚C230˚CNaturalcooling180˚C150˚C30smax.60to120smax.Time(s)•Allspecificationsaresubjecttochangewithoutnotice.(2/3)002-03/20040722/e521_mlk0603.fmInductorsMLKSeriesMLK0603TypeForHighFr

8、equencySMDELECTRICALCHARACTERISTICSInductanceInductanc