igbt的散热设计

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1、南京银茂微电子制造有限公司NanjingSilverMicroElectronics,Ltd.功率模块及装置的热设计功率模块及装置的热设计南京银茂微电子制造有限公司NanjingSilverMicroElectronics,Ltd.ThepurposeofthermaldesignOverheated-ThePrimaryCauseforFailureinElectronicEquipmentFigure1:JunctionLifeStatisticsMajorCausesofElectronicsFailures故障率（55%Temperature20%Vibration6%

2、Dust10万小时）19%Moisture(Source:USAirForceAvionicsIntegrityProgram)(Source:GECResearch)南京银茂微电子制造有限公司NanjingSilverMicroElectronics,Ltd.TheutilizationsofthethermalsimulationShortdevelopmenttimeMoreandmorecomplicatedproductsLowcostexpectationEtc…ConceptDesignHardwareHandcalculations/Estimation

3、/simpleCFDCFDTestingThethermaldesigner'simpactontheTimeProductdevelopmentcycleproductschedule南京银茂微电子制造有限公司NanjingSilverMicroElectronics,Ltd.Mainpurposesofthermalanalysis1.Predictionofcomponenttemperatures;2.Designoptimizationforgoodreliability.南京银茂微电子制造有限公司NanjingSilverMicroElectronics,Ltd.T

4、hermalDesignIncluding:Dielevel---ChipComponentlevel---PackageBoardlevel---PCBSystemlevel---ModuleEnvironmentlevel---RelatedtoVent南京银茂微电子制造有限公司NanjingSilverMicroElectronics,Ltd.ThermalsimulationBoardlevelComponentslevelSystemlevelEnvironmentlevel南京银茂微电子制造有限公司NanjingSilverMicroElectronics,Ltd.

5、BoardlevelComponentslevelSystemlevelEnvironmentlevel南京银茂微电子制造有限公司NanjingSilverMicroElectronics,Ltd.MethodsforHeatDissipationNaturalConvectionandRadiationTraditionalForced-airConvectionCoolingStylesThermoelectricCoolingCategoriesaccordingSingle-PhaseLiquidtoheattransferdevices:Cooling•Heatpip

6、e:generaltypeheatpipe,Loopheatpipe,CapillaryNewTwo-PhaseLiquidpumploopheatpipe,pulsating/Coolingoscillatingheatpipe,microheatpipeetc.HeatConductionviaEmbeddedSolids•Microchannelheatexchanger•Refrigerationsystem•Liquidjetcooling“Synthetic”JetCooling南京银茂微电子制造有限公司NanjingSilverMicroElectronics,L

7、td.HowtoChooseaProperMethod?Thegraphshowsheatfluxdensityandvolumetricpowerdensityofallofcoolingmethodswhentemperatureincrementis40degC.南京银茂微电子制造有限公司NanjingSilverMicroElectronics,Ltd.ReferenceforChoosingCoolingMethodSurfaceHeatFluxDensity,W/cm2Coeff