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1、华中科技大学硕士学位论文ACA封装电子标签的工艺与可靠性研究姓名：褚华斌申请学位级别：硕士专业：材料学指导教师：吴懿平;安兵20070430华中科技大学硕士学位论文AbstractRFID(radiofrequencyidentification)isconsideredasthemostpopularattentiveandadvancedcontactlesssensorrecognitiontechnologyandwidelyusedinwirelessbusiness,identification,m
2、anufacturing,transportation,logisticsandotherareas.ThoughRFIDwilleventuallyreplacebarcode,oneofthebottleneckswhichpreventitswiderandlarger-scaleuseisthehighpriceofRFIDtag.Withchipandantennamanufacturingcostsdroppingcontinuously,therelativeshareofpackagingcos
3、tgraduallyincreases,ThereforetheFlipChiptechnologyofusingACA(anisotropicconductiveadhesive)topackageandmanufacturethelow-costRFIDtaghasbeenwidelyconcernedandappliedinindustry.ThispaperfocusedontheresearchontheprocessandreliabilityofRFIDtagpackagedbyACA.TheHe
4、at-Pressingtimewassetfor10s,theAu-sprayedRFchipwasadoptedespeciallytomakethetestsamplestodeterminetheappropriatepressurefor1.4MPa,thenthreekindofACAweretestedtopackagetheRFIDtagundervariousheat-pressingtemperaturetostudyonthetemperatureontheeffectofelectrica
5、l,mechanicalandRFresponsepropertiesofRFIDtagduringenvironmentreliabilitytest(HTH,85ºC,85%RH,168handHTS,85ºC,168h).Alsothewindingtest,statictensiontestandpurebendtestweredesignedtoevaluatethereliabilityofflexibletagbearingbreakandbendstress.Thetestresultsindi
6、catedthat:ForACA-1withNi-coatingpolymersphereparticles,whenthetemperaturewasbelow160ºC,theACAwasnotcuredandlowbondstrengthandhighcontactresistancewereobtained.Whenthetemperaturewasabove170ºC,thecontactresistancewasincreasedmoreandbondstrengthdecreasedafterHT
7、Htest.So160ºCiscomparativelymoresuitableHeat-Pressingtemperature.UnderasuitableHot-Pressingtemperatureof120ºC,theaveragecontactresistanceoftagpackagedbyACA-2whichcontainedNiparticleswasII华中科技大学硕士学位论文about4Ω,butafterHTHtestsitwasincreased1∼4timesandafterwindi
8、ngtestitincreasedonlyabout50%,soACA-2wasfitforflexibletemperature-sensitivePETantennasubstrate.Thedestructivepowerofwindingtestwasmainlyfrompurebendanddestructivepowerfromstatictensionwasnotfoun
