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ID:37070615
大小:2.66 MB
页数:77页
时间:2019-05-16
《时序驱动布局设计与实现》由会员上传分享,免费在线阅读,更多相关内容在学术论文-天天文库。
1、分类号TP391.7学号14060003UDC621.3密级公开工学硕士学位论文时序驱动布局设计与实现硕士生姓名郭泽晖学科专业电子科学与技术研究方向VLSI物理设计指导教师郭阳研究员国防科学技术大学研究生院二〇一六年十一月DesignandImplementationofaTiming-DrivenPlacementCandidate:GuoZehuiAdvisor:GuoYangAdissertationSubmittedinpartialfulfillmentoftherequirementsforthedegreeofMast
2、erofEngineeringinElectronicScienceandTechnologyGraduateSchoolofNationalUniversityofDefenseTechnologyChangsha,Hunan,P.R.ChinaNovember,2016国防科学技术大学研究生院硕士学位论文目录摘要..............................................................................................................
3、.................iABSTRACT.....................................................................................................................ii第一章绪论....................................................................................................................11.
4、1研究背景...........................................................................................................11.2研究现状...........................................................................................................31.2.1国外的研究现状.............................
5、.......................................................31.2.2国内的研究现状....................................................................................51.3研究目标与研究内容.......................................................................................61.3.1研究目标.......
6、.........................................................................................61.3.2研究内容................................................................................................61.4论文组织结构................................................................
7、...................................7第二章VLSI物理设计和布局问题描述.......................................................................82.1三维芯片简介...................................................................................................82.1.1三维集成电路技术概述...................
8、.....................................................82.1.2三维芯片TSV互连技术...............................................
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