《硅片切割工艺讲义》PPT课件

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1、硅片切割工艺讲义制造二部林青云2006年3月主要内容1、车间流程的介绍2、Squarer的介绍3、CroppingSaw的介绍4、Grinder的介绍5、gluingBrick的介绍6、WireSaw7、CleaningStation的介绍1、车间流程的介绍Building1Layout2、SQUARER的介绍3、CroppingSawBANDSAWSliceusablelengthofbrickbycroppingtop&bottomUsablelengthofbrickisdeterminedbytheLifetimetester.Speciald

2、iamondcoatedbladeisusedforcroppingBladerotatesatconstantspeed.MounttheBrickSuitablyontheTableTablemovesatsetspeedtoslicethebrickMaximumperformancewillcomefromproperbandalignment,tensioningandbandspeed.Silicon:Productiscutusingwaterasthecoolant(Someprefertoconditionthewatertomini

3、mizecontaminationofthesiliconmetal).Cuttingratesarerelativelyslow,approximately2-4in²perminute.Propergritsizeselectionisimportanttominimizechippingoftheworkpiece.Smallergritsize,suchas80/100mesh,willslowcuttingratesbutimprovesurfacefinish.Maximumperformancewillcomefromproperband

4、alignment,tensioningandbandspeed.Silicon:Productiscutusingwaterasthecoolant(Someprefertoconditionthewatertominimizecontaminationofthesiliconmetal).Cuttingratesarerelativelyslow,approximately2-4in²perminute.Propergritsizeselectionisimportanttominimizechippingoftheworkpiece.Smalle

5、rgritsize,suchas80/100mesh,willslowcuttingratesbutimprovesurfacefinish.Silicon:Productiscutusingwaterasthecoolant(Someprefertoconditionthewatertominimizecontaminationofthesiliconmetal).Thin-bandsaws(consistingofanendless,high-strengthsteelbandwithanelectroplateddiamondcuttingedg

6、e)iscapableofcuttinglarge-diametersiliconingotsandotherlargediametermaterialsaccuratelyandefficientlyandcanbemanufacturedindifferentsizes.Cuttingratesarerelativelyslow,approximately2-4in²perminute.Propergritsizeselectionisimportanttominimizechippingoftheworkpiece.Smallergritsize

7、,suchas80/100mesh,willslowcuttingratesbutimprovesurfacefinish.SPECIFICATIONSBandSpecifications:Diamondcoatedsteelblade.Length:240",Width:1",Thickness:0.020",Grit:80/100CuttingSpecifications:Feedrate:0.5”to1”perminuteFeedpressure:100PSI(1Bar=14.5PSI)Bladetension:22000PSIBeltSpeed

8、:3500~4000FPMBRICKPREPARATIONIngotisslicedinto1