微电子封装可靠性设计中的强度失效问题

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1、微电子封装可靠性设计中的强度失效问题陈旭天津大学化工学院过程装备与控制工程系LaboratoryofComputerAidedReliabilityEngineeringSchoolofChemicalEngineeringTianjinUniversity,Tianjin300072,P.R.ChinaEmail:xchen@tju.edu.cn已成为国际上最热的研究领域之一，涉及材http://www.tju-hj.com1料、机械、电子，电化学，工程热物理等2IntroductionofElectronicPackagingICPackageWhatisapackage?

2、AgSBBExampleforFCBGAadhesive(StudBumpBonding)InsertiontypeNSD(NonConductiveAdhesiveStud-BumpDirectInterconnection)ICCompressioACFJointnjointpackagemethod(AnisotropicConductiveFilm)methodFunctionsofpackagesSurface(Underfill)MBBmounting(MicroBumpBonding)typeGGIMetallicjunction(GoldtoGoldInterc

3、onnection)•Protectingfromtheexternalenvironment•EnablingelectricalconnectivityC4/FCA(ControlledCollapseChipConnection/FCSolderAttach)GBS•Heatradiation•Improvingfunctionality3(GoldBumpSoldering)4CSP1主要研究课题焊锡钎料力学性能及多轴疲劳•焊锡钎料性能及焊点可靠性(solder)•焊锡钎料多轴循环性能•各向异性导电胶的粘接性能(ACF)•循环本构模型研究传统的研•塑封电子器件的湿热失效

4、(moldingcompound)究方法•焊锡钎料多轴疲劳性能•功率电子器件封装（LED)•尺寸效应56Solderjointreliability782910ReliabilityAnalysisofFCOFandFCOBExperiment:3-DTestSamplesFCOF:flipchiponflexassembly;柔性基板FCOB:flipchiponrigidboardassembly;刚性基板(a)(b)(a)Dimensionsandsolderjointlocationsoftemperaturecyclingtestchips;(b)Thermalcyc

5、lingvehicle.11123AcceleratedTemperatureCyclingLoadingThermalMechanicalAnalysis(TMA)(a)TMA:(a)Cross-sectionview;(b)Topview;(b)(c)(a)(b)(c)ProbelocationsTemperaturecyclingconditions:(a)conditionI;(b)conditionII1314Non-linearFiniteElementModelingExperimentalResultsandFEA(a)(b)Finiteelementmodel

6、ingofFCOFandFCOBassemblyFEAresults:comparisonsofvonMisesstress/vonMisesplasticstrainandtheshearstress/shearplasticstraininthesolderjointsunderthermalcyclingconditionI15164ExperimentalResultsandFEA(a)(b)Typicalelectricalresistanceincreasesofsolderjointsinaflip-chiponrigidThetypicalTMAtraceand

7、FEAresultsofflexdisplacementatpoint1inPCBboardassemblyunderthethermalcyclingconditionIaFCOFassemblythroughthreetemperaturecycles1718ExperimentalResultsandFEA(a)(b)ComparisonofpredictedandmeasuredlifeforFCOFandFCOBsolderjointsunderthermalconditionIa