超精密磨削蓝宝石基片的软磨料砂轮磨削性能

超精密磨削蓝宝石基片的软磨料砂轮磨削性能

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大小:7.68 MB

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时间:2019-05-12

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1、大连理工大学硕士学位论文超精密磨削蓝宝石基片的软磨料砂轮磨削性能姓名:程国良申请学位级别:硕士专业:机械制造及其自动化指导教师:康仁科20081218超精密磨削蓝宝石基片的软磨料砂轮磨削性能J'●●●,’^●■'o'kinndlnRpertormanceotSOnabraSlVegrlnamzWneeJUsedinultra-precisiongrindingsapphiresubstrateAbstractSapphiresinglecrystalhaswonderfulthermalcharacter,electricalproperties,highertransmittance,wea

2、ringqualityandhigherhardness.Therefore,itwidelybeusedinlargescreencolorfuldisplay,speciallighting,trafficsigrlal,opticalcommunicationfieldseta1.It’Salsotheideasubstratematerialforhighperformancesemiconductorchip,atthesametimeitextensivelybeusedinmilitaryfieldasthewindowmaterialforinfraredreceiversan

3、dsensors.Ithasthehighdemandinsurfaceprocessingprecisionandsurfaceintegritynotonlyinmicro-electronicsandphotoelectronfields,butalso嬲thedetectwindowmaterial.TheMohshardnessofsapphimsinglecrystalis9,SOit’Sdifficulttoprocessing.Loosediamondabrasivelappinghavethelowefficiency,abrasivelargeconsumption,hi曲

4、processingcostandcauseseveresurface/subsurfacedamage.ThefinalCMPprocessingalsohavethelowefficiency,andit’Sdifficulttohandlethealkalescencyoracidityslurry.Thepaperproposesthesapphiresubstratesoftabrasivegrindingwheelprocessingmethodaimingattheproblemsinprocessing.Thegrindedsapphiresubstratenotonlyhas

5、thesurfaceprocessingprecisionandhighefficiency,butalsothelowdamagesurface.Accordingtosapphire’Sphysicochemicalcharacteristics,thepaperoptimizedselectthecompositionsofsoftabrasivesharper,designthesoftabrasiveshaperformulasandstructure,researchtheshaperprocessingtechnology,developthetwodifferentmainma

6、teriallappingplate.Studythekilldofabrasives,lappingplatespeed,lappingpressureinfluenceonprocessingquality.Basedonthis,improvethesoftabrasivegrindingwheelformulas,anddesignthestructureofsoftabrasivegrindingwheel,manufacturethetwodifferentmainmaterialcup—typesoftabrasivegrindingwheel,carrythematchexpe

7、rimentsusingthediamondgrindingwheelinsamemesh,studythegrindingperformanceofsoftabrasivegrindingwheel.ThetestindicatethatsapphiresubstrateCanachievesuper-smooth,lowdamageprocessingsurfaceandhi曲material

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