smt_毕业论文

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1、毕业设计论文作者王磊学号系部计算机科学系专业SMT题目波峰焊接及其缺陷分析指导教师评阅教师完成时间：毕业设计(论文)中文摘要22题目：波峰焊接及其缺陷分析摘要：波峰焊是指将熔化的软钎焊料（铅锡合金），经电动泵或电磁泵喷流成设计要求的焊料波峰，亦可通过向焊料池注入氮气来形成，使预先装有元器件的印制板通过焊料波峰，实现元器件焊端或引脚与印制板焊盘之间机械与电气连接的软钎焊，也可称为群焊或流动焊。这种焊接方法主要用于传统通孔插装工艺，以及表面组装与通孔插装元器件的混装工艺，适合波峰焊的表面贴装元器件有矩形和圆柱形片式元件、SOT以及较小的SOP器件等

2、。本文通过介绍波峰焊的定义、工艺方式、过程分析、缺陷分析等，提出波峰焊接的各种缺陷以及解决的各种方法。关键词：波峰焊缺陷分析22毕业设计(论文)外文摘要Title:WaveSolderingIntroductionandItsDefectAnalysisAbstract:Wavesolderingreferstothesoftmeltsolderingmaterial(leadtinalloy)，theelectricpumporelectromagneticpumpsprayflowintothedesignrequirementssolde

3、r，italsocanthroughpeakstoinjectnitrogentoformsolderspool，withcomponentsinadvancebythewave，PCBsolderingweldingsideorofcomponentswithpinsPCBpadofmechanicalandelectricalconnectionbetweenthesoftbrazing，canalsobecalledgroupofweldingorflowwelding.Thiskindofweldingmethodismainlyuse

4、dintraditionalthrough-holecartridgeprocess，aswellassurfaceassemblyandthrough-holecartridgecomponentsfordualwavesolderingprocess，SMTcomponentsarerectangularandcylindricalelectroniccomponent，SOTandsmallerSOPdevices，etc.Thispaperintroducesthedefinition，wavesolderingprocessmetho

5、d，processanalysis，defectanalysisintheoperatingprocessandputsforwardthemethodsofsolderingdefectandsolvedallkindsofthesolderingdefects.Keywords:WaveSolderingDefectsAnalysis22目录毕业设计（论文）中文摘要···········································1毕业设计（论文）外文摘要·································

6、··········21引言······························································42波峰焊工艺························································42.1波峰焊的定义················································42.2波峰焊的种类················································52.3波峰焊接原理··········

7、······································63波峰焊组成及设备简介··············································83.1波峰焊机的组成··············································83.2波峰焊设备简介··············································94波峰焊流程及作用·················································105波峰焊

8、中助焊剂的工艺方式·········································12226波峰焊接工艺参数设置及温度曲线解析···