化学机械研磨终点监测方法分析

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1、哈尔滨工业大学工程硕士学位论文目录摘要...................................................................................................................IAbstract.............................................................................................................

2、.II第1章绪论....................................................................................................11.1集成电路的国内外现状和发展................................................................11.2集成电路制造工艺及现状................................................

3、........................21.3集成电路工艺中CMP工艺及现状..........................................................41.4终点（Endpoint）检测系统及现状..........................................................61.5本课题研究内容...........................................................

4、.............................8第2章集成电路制造过程中的CMP工艺.......................................................92.1引言...........................................................................................................92.2传统的平坦化方法与化学机械研磨.................

5、........................................92.3化学机械研磨（CMP）的工艺过程......................................................102.4化学机械研磨（CMP）的工艺种类......................................................102.4.1氧化硅膜的化学机械研磨.............................................

6、..................102.4.2层间绝缘膜的化学机械研磨...........................................................112.4.3浅沟槽隔离工艺化学机械研磨（STI-CMP）.................................112.4.4多晶硅的化学机械研磨...................................................................112.4.5金属膜

7、的化学机械研磨...................................................................112.5化学机械研磨的研磨要求及目标...........................................................122.6化学机械研磨的设备..............................................................................142.6.1荏

8、原半导体（Ebara）的化学机械研磨设备...................................152.6.2应用材料公司（AMAT）的化学机械研磨设备.............................162.6.3化学机械研磨设备的基本原理........................................................172.6.4研磨原理和影响参数................................