x波段mmic陶瓷qfn高密度封装技术的分析

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1、万方数据AbstractThisPapergivesadetailedintroductionaboutthedevelopmentandtrendofelectronicpackaging，andanalyzestheQFNpackagingtechnology,especiallytheQFNpackagingofceramic．BecauseQFNpackagingtechnologyhasvariousadvantagesofsmallsize，highpackagingdensity,goodelectromagneticandthermalp

2、erformance，modular,lowcost，therehasbeenacontinuingdevelopmentofreplacingthetraditionalpackagingformsusingQFNpackage．Moreover,QFNceramicpackageismoreandmorefavoredbytheuserswhorequestthehighreliabilityapplication，duetoitshermeticandtheadvantagesofhighreliability．InthisPaper,thecir

3、cuitstructureofMMICpackageinXbandwasdesignedandoptimizedwiththe3DelectromagneticsimulationsoftwareHFSS．Themicrowavetransmissioncharacteristicsofthree．dimensionaltransmissionportwereeffectivelyimprovedthroughaddinghighinductancecompensationstructureandinsertingtransitionstructureb

4、etweenmicrostripandstripline．Thefrequencyresonanceat6．5GHzand11．5GHzwereeliminatedbyaddingadensearrayofgroundingviaholeatthebottomofthepackage．Finally,twogoodsimulationresultshadbeenobtained．oneWasthattheinsertionlOSSWaslessthan0．5dBatXband，andtheotheroneWasthatthevoltagestanding

5、waveratiowaslessthan1．3．Theperformancesofactualproductweremeasured．andtheexperimentalresultsagreedwellwiththecalculatedresults．Baseonthetheoryandmethodofthestructureandthermaldesignofpackage，themodelsofstructureandthermalanalysisoftwokindsofpackageshavebeenestablishedbythefinitee

6、lementanalysissoftwareANSYS．Thestructurestressanalysisoftwopackagesinbrazingconditionswereperformed，andthensimulationanalysisofradiatingeffectoftwopackagesinatypicalhighpowerchippackagingapplicationwereinvestigated．Moreover,Utilizingthestudiesofprocessdesignandkeytechnologies，the

7、QFNceramicpackagesofhighpackagingdensitywith5mmX5mmdimensionsand32pinshavebeensuccessfullyachieved．Keywords：HTCC，QFN，Highdensitypackaging，MMICIII万方数据东南大学硕士学位论文万方数据目录中文摘要⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯IAbstract．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．

8、．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．．