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ID:34584751
大小:16.38 MB
页数:67页
时间:2019-03-08
《x波段mmic陶瓷qfn高密度封装技术的分析》由会员上传分享,免费在线阅读,更多相关内容在行业资料-天天文库。
1、万方数据AbstractThisPapergivesadetailedintroductionaboutthedevelopmentandtrendofelectronicpackaging,andanalyzestheQFNpackagingtechnology,especiallytheQFNpackagingofceramic.BecauseQFNpackagingtechnologyhasvariousadvantagesofsmallsize,highpackagingdensity,goodelectromagneticandthermalp
2、erformance,modular,lowcost,therehasbeenacontinuingdevelopmentofreplacingthetraditionalpackagingformsusingQFNpackage.Moreover,QFNceramicpackageismoreandmorefavoredbytheuserswhorequestthehighreliabilityapplication,duetoitshermeticandtheadvantagesofhighreliability.InthisPaper,thecir
3、cuitstructureofMMICpackageinXbandwasdesignedandoptimizedwiththe3DelectromagneticsimulationsoftwareHFSS.Themicrowavetransmissioncharacteristicsofthree.dimensionaltransmissionportwereeffectivelyimprovedthroughaddinghighinductancecompensationstructureandinsertingtransitionstructureb
4、etweenmicrostripandstripline.Thefrequencyresonanceat6.5GHzand11.5GHzwereeliminatedbyaddingadensearrayofgroundingviaholeatthebottomofthepackage.Finally,twogoodsimulationresultshadbeenobtained.oneWasthattheinsertionlOSSWaslessthan0.5dBatXband,andtheotheroneWasthatthevoltagestanding
5、waveratiowaslessthan1.3.Theperformancesofactualproductweremeasured.andtheexperimentalresultsagreedwellwiththecalculatedresults.Baseonthetheoryandmethodofthestructureandthermaldesignofpackage,themodelsofstructureandthermalanalysisoftwokindsofpackageshavebeenestablishedbythefinitee
6、lementanalysissoftwareANSYS.Thestructurestressanalysisoftwopackagesinbrazingconditionswereperformed,andthensimulationanalysisofradiatingeffectoftwopackagesinatypicalhighpowerchippackagingapplicationwereinvestigated.Moreover,Utilizingthestudiesofprocessdesignandkeytechnologies,the
7、QFNceramicpackagesofhighpackagingdensitywith5mmX5mmdimensionsand32pinshavebeensuccessfullyachieved.Keywords:HTCC,QFN,Highdensitypackaging,MMICIII万方数据东南大学硕士学位论文万方数据目录中文摘要⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯IAbstract......................................................................
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