印制电路术语分类汇总4

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1、PrintedCircuitBoardFabricationSeminar印制板制造技术研讨1．BasicPCBConstruction&Terminology基础PCB制造术语和名词2．Quotations引文3．FrontEndEngineering前后工程处理i)PAR(ProduceabilityAnalysisReview)PAR可制作性评审ii)ProductEngineering工程制作iii)CAM(ComputerAidedManufacturing)计算机辅助制造iv)Photoplo

2、tting光绘4．ManufacturingProcess制作过程i)lnnerLayer内层ii)Multilayer层压iii)NCDrilling数控钻床iv)ElectrolessCopper化学沉铜v)OuterLayerlmaging外光成像vi)WetProcesses湿法流程vii)Soldermask阻焊viii)SolderableFinishes(HASL&Alternatives)表面涂覆（热风整平或其他可以选择的方法）ix)TabGoldPlating镀金手指x)Idents字符

3、xi)NCRouting数控铣外形xii)QCInspectionQC检查5．FrequentlyAskedQuestions常见问题i)Solderability可焊性ii)IonicCleanliness离子污染度iii)ControlledLmpedance阻抗控制iv)Blind&BuriedVias盲埋孔6．PCBSpecificationsPCB规范7．FutureTechnologiesPCB未来发展技术i)Microvia第一部分BasicPCBConstruction&Terminolo

4、gy基本PCB构造和技术BasicMultilayerFollBuild多层板叠合结构CopperFoil铜箔Prepreg半固化片Core芯片Prepreg半固化片Core芯片Prepreg半固化片Example：FoilBuild-6layerboard样板：6层板结构BasicPCBConstructionMaterials制造原料Laminates(cores,C-Stage)铜箔（芯板、C－阶段）·fullycuredfiberglass-resinsystem完全胶连的玻璃树脂系统·coppe

5、rclad铜箔·identifiedbycorethickness,copperweight鉴别芯片厚度、铜箔重量“Prepregs”(B-stage)半固化片（B阶段）·Pre-impregnatedBondingLayers提前注入连接层·Partiallycuredfiberglass-resinsystem部分胶连的玻璃布树脂系统·identifiedbyglasstype根据玻璃布类型鉴别CopperFoils铜箔·Electrodeposited(ED)Std&DSTE电解铜或压延铜过程·1O

6、z=0.0014”KeyFactors关键因素·GrainDirection晶粒方向·ScalingFactors缩放比例因素·SingleSourceVendorsSampleLaminatesLaminateNominalToleranceConstructionDk覆铜板样板实际尺寸公差结构介电常数0.00250.0025＋/－0.000710804.280.00500.0055＋/－0.0010106/23134.400.00500.0062＋/－0.00101080/23134.500.0080

7、0.0085＋/－0.00152313/21164.430.00950.0097＋/－0.00152*21164.430.01200.0124＋/－0.00151080/7628/10804.550.02100.0215＋/－0.00253*76284.750.02800.0287＋/－0.00254*76284.750.04700.0470＋/－0.00507*76284.80PartNumbering编号含义Naturalcolor自然颜色pits&dentsclass凸点级别Flameretarda

8、nt阻燃剂thickensstoleranceclass厚度公差级别Glassreinforcement玻璃布加强warp&twistclass弯曲和扭曲级别GFN－0620－C1/C1－B2XThicknessoflaminatecopperfoiltype(top/bottom)铜箔类型（顶层）板料厚度copperfoilthickness(top/bottom)铜箔厚度（顶层）Sampleprepregs半固化片样品Gl