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ID:34440903
大小:1.01 MB
页数:5页
时间:2019-03-06
《2011-交大学报-sic应力分析》由会员上传分享,免费在线阅读,更多相关内容在教育资源-天天文库。
1、!45"!1#!"#$%&&'Vol.45No.12011$1%JOURNALOFXI′ANJIAOTONGUNIVERSITYJan.2011!"#$%&(犘犞犜)'()*+,-./0123456-./,RST,456,UVW(XYZ[G?]^_`aBCbcdef,710049,XY)78:()*+,-./012345(PVT).6789:;<=>?@AB3CDE67FGHIJKLMNO.PQRS:T3C;<67FG?,KLMU%VW@AT;2、ijkLMfNlmnomp;qcEircE67FGBdefg3LBKLhfijkLMfNlmh9o%,stTqcEB?u`aircEBvw`axyTo%BLMV.z{,3、}~;<,}@TYZ[]L689:=KLMB-.,89:;<67,89:;?:TN304.2@ABCD:A@EF?:0253?987X(2011)01?0117?05犜犺犲狉犿犪犾犛狋狉犲狊狊犃狀犪犾狔狊犻狊狅犳犆狉狔狊狋犪犾犕狅狉狆犺狅犾狅犵狔犻狀犌狉狅4、狑狋犺狅犳犛犻犾犻犮狅狀犆犪狉犫犻犱犲犅狌犾犽犆狉狔狊狋犪犾犫狔犘犞犜犕犲狋犺狅犱SHIYonggui,DAIPeiyun,YANGJianfeng,LIUGuangliang(StateKeyLaboratoryforMechanicalBehaviorofMaterials,Xi′anJiaotongUniversity,Xi′an710049,China)犃犫狊狋狉犪犮狋:Threekindsofclassicalgrowthmorphologiesappearinginthephysicalvapo5、rtransport(PVT)growthprocessofsiliconcarbidebulkcrystalareanalyzedwithregardtothermalstressbyfiniteelementsmethod.Theresultsindicatethatthemaximumofthermalstressislocatedintheadjacentregionofthesiliconcarbideandthegraphitecruciblelid.Thedistributionsofthet6、emperaturefield,andthecorrespondingthermalstrainfieldandequivalentstressfieldgetmorehomogenousintheflatgrowthmorphologythanthatintheconcaveandconvexgrowthmorphology.Andstressconcentrationappearsatthecenteroftheconcavegrowthmorphologyandatthemarginofthecon7、vexgrowthmorphology.Forimprovingthecrystalquality,transitionlayerofsiliconcarbideformedbydepositionorreactiononthegraphitecruciblelidissuggestedtoreducethethermalstress,andthegrowthsystemofSiCcrystalshouldbemodifiedtomaintaincrystalgrowthintheflatmorpholog8、y.犓犲狔狑狅狉犱狊:physicalvaportransport(PVT);siliconcarbidebulkcrystal;thermalstress;finiteelementmethod7)g!hij9、}~a(y2.0×10Lir,stu^_vwxnma(y6cm/s)、z`(y2.1×10V/cm)10、z&'(#:2010?06?24.)*+,:-./(1982-),0,123;456(789),0,:;,123<=.>?@A:BCDEFG>11、?HI@A(50672073).JKLMNO:2010?10?19JKLMPQ:http:∥www.cnki.net/kcms/detail/61?1069_t.20101019.2058.009.html118XYZ[GG¿!45"<(4.9W/(cm·K))p,NäNèéäg,,-RÆk3©1op±<äNwtGztG.pʱn8,¦#gt3©E¥4P.p、tGstu^_z、z、z1>С、¢£、¤¥¦§¨©
2、ijkLMfNlmnomp;qcEircE67FGBdefg3LBKLhfijkLMfNlmh9o%,stTqcEB?u`aircEBvw`axyTo%BLMV.z{,
3、}~;<,}@TYZ[]L689:=KLMB-.,89:;<67,89:;?:TN304.2@ABCD:A@EF?:0253?987X(2011)01?0117?05犜犺犲狉犿犪犾犛狋狉犲狊狊犃狀犪犾狔狊犻狊狅犳犆狉狔狊狋犪犾犕狅狉狆犺狅犾狅犵狔犻狀犌狉狅
4、狑狋犺狅犳犛犻犾犻犮狅狀犆犪狉犫犻犱犲犅狌犾犽犆狉狔狊狋犪犾犫狔犘犞犜犕犲狋犺狅犱SHIYonggui,DAIPeiyun,YANGJianfeng,LIUGuangliang(StateKeyLaboratoryforMechanicalBehaviorofMaterials,Xi′anJiaotongUniversity,Xi′an710049,China)犃犫狊狋狉犪犮狋:Threekindsofclassicalgrowthmorphologiesappearinginthephysicalvapo
5、rtransport(PVT)growthprocessofsiliconcarbidebulkcrystalareanalyzedwithregardtothermalstressbyfiniteelementsmethod.Theresultsindicatethatthemaximumofthermalstressislocatedintheadjacentregionofthesiliconcarbideandthegraphitecruciblelid.Thedistributionsofthet
6、emperaturefield,andthecorrespondingthermalstrainfieldandequivalentstressfieldgetmorehomogenousintheflatgrowthmorphologythanthatintheconcaveandconvexgrowthmorphology.Andstressconcentrationappearsatthecenteroftheconcavegrowthmorphologyandatthemarginofthecon
7、vexgrowthmorphology.Forimprovingthecrystalquality,transitionlayerofsiliconcarbideformedbydepositionorreactiononthegraphitecruciblelidissuggestedtoreducethethermalstress,andthegrowthsystemofSiCcrystalshouldbemodifiedtomaintaincrystalgrowthintheflatmorpholog
8、y.犓犲狔狑狅狉犱狊:physicalvaportransport(PVT);siliconcarbidebulkcrystal;thermalstress;finiteelementmethod7)g!hij9、}~a(y2.0×10Lir,stu^_vwxnma(y6cm/s)、z`(y2.1×10V/cm)10、z&'(#:2010?06?24.)*+,:-./(1982-),0,123;456(789),0,:;,123<=.>?@A:BCDEFG>11、?HI@A(50672073).JKLMNO:2010?10?19JKLMPQ:http:∥www.cnki.net/kcms/detail/61?1069_t.20101019.2058.009.html118XYZ[GG¿!45"<(4.9W/(cm·K))p,NäNèéäg,,-RÆk3©1op±<äNwtGztG.pʱn8,¦#gt3©E¥4P.p、tGstu^_z、z、z1>С、¢£、¤¥¦§¨©
9、}~a(y2.0×10Lir,stu^_vwxnma(y6cm/s)、z`(y2.1×10V/cm)
10、z&'(#:2010?06?24.)*+,:-./(1982-),0,123;456(789),0,:;,123<=.>?@A:BCDEFG>
11、?HI@A(50672073).JKLMNO:2010?10?19JKLMPQ:http:∥www.cnki.net/kcms/detail/61?1069_t.20101019.2058.009.html118XYZ[GG¿!45"<(4.9W/(cm·K))p,NäNèéäg,,-RÆk3©1op±<äNwtGztG.pʱn8,¦#gt3©E¥4P.p、tGstu^_z、z、z1>С、¢£、¤¥¦§¨©
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