毕业设计（论文）-al离子掺杂mn3o4基膜片温敏材料的制备与性能研究1

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1、Al离子掺杂Mn3O4基膜片温敏材料的制备与性能研究摘要本文研究了FeMnNi1-xAlxO4的制备、结构与性能。利用塑性成型法成型，以高温固相法制备FeMnNi1-xAlxO4。用Y2000Automatedx-rayDiffractometersystem对样品的相结构进行分析。用型号为SEMI-VICKERSHARDNESSTESTERHV-10的维氏硬度仪测量样品的硬度。用自制的设备测量样品的温阻特性。结果表明，所掺杂的氧化铝与FeMnNiO4形成了固溶体；已制备好的NTCTherelationshipbetweenlogresistivity(logρ)andtherec

2、iprocaloftheabsolutetemperature(1/T)ofthepreparedNTCthermistorswasnearlylinear,indicativeofNTCcharacteristics.Itwasfoundthattheelectricalresistivity,B25/85constant,andactivationenergyofthethermistorsincreasedwithincreasingAl2O3conten热敏电阻电阻率和绝对温度的倒数之间的关系为线性关系，显示了所制备材料的负温度系数特性；随着Al2O3掺量的增加，样品的B值

3、逐渐增加，且老化后各样品的B值增大，对温度变化的敏感性增强；在热敏常数B为定值时，NTC的电阻率随着氧化铝含量的增加而增加。关键词FeMnNi1-xAlxO4负温度系数热敏电阻塑化剂固溶体B值33Al离子掺杂Mn3O4基膜片温敏材料的制备与性能研究AbstractInthispaper,thepreparation、structuresandpropertiesofFeMnNi1-xAlxO4havebeendiscussed.UsingplasticizertohelpshapeandhightemperaturesolidstatereactiontoprepareFeMnNi

4、1-xAlxO4. WithY2000Automatedx-rayDiffractometersystem,thephasestructureofthesampleswereanalyzed. ThehardnessofthesamplewasmeasuredbythemodelSEMI-VICKERSHARDNESSTESTERHV-10Vickershardness. Usinghomemadeequipmenttoanalyzetemperatureandresistancecharacteristicsofthesample. Theresultsshowthattheal

5、uminaandotheroxidesformedsolidsolution;Therelationshipbetweentheresistivityofthesampleandthereciprocalofabsolutetemperatureislinear,whichjustshowedthenegativetemperaturecoefficientcharacteristicsofNTC ;WiththeAl2O3contentincreasing,thevalueofBgraduallyincreased,andafteraging,thevalueofBalsoinc

6、reaseed,whichshowedthetemperaturesensitivityofthesamplewasmorestrength;WhenthethermalconstantBisconstant,NTCresistivityincreasedwith aluminacontentincreases.Keywords:FeMnNi1-xAlxO4NTCplasticizersolidsolutionthethermalconstantB33Al离子掺杂Mn3O4基膜片温敏材料的制备与性能研究目录摘要IAbstractII目录III第一章综述11．1负温度系数(NTC)热

7、敏电阻材料体系11．1．1NTC热敏电阻的历史11．1．2NTC热敏电阻的基本特征参数21．1．3NTC热敏电阻种类及材料组成体系31．2NTC热敏电阻的制备41．2．1粉体制备51．2．2生坯成型61．2．3烧结71．2．4电极制备71．2．5阻值调整71．2．6敏化与老练71．3室温固相反应法制备NTC陶瓷粉体81．3．1固相反应机理81．3．2影响因素91．4NTC热敏电阻的应用及发展趋势91．4．1NTC热敏电阻的应用91．4．2NTC热敏电阻发展方向121．