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1、GuidelinesforHandlingJ-Lead,QFP,BGA,FBGA,andLidlessFBGADevicesAN-071-5.0ApplicationNoteThisapplicationnoteprovidesguidelinesforhandlingJ-Lead,QuadFlatPack(QFP),andBall-GridArray(BGA,includingFineLineBGA[FBGA]andlidlessFBGApackaging)devicestopreservethequalityofthesedevicesduringst
2、orage,shipment,andtransferandtoensureeasiersoldering.Devicesthatusesurface-mountJ-Lead,QFP,BGA,FBGA,andlidlessBGAarenowcommononboardsbecausetheyprovidedensity,size,andcostbenefits.However,afewprecautionsarenecessarytoprotectthesedevicesfrommechanicaldamageduringtransportationandst
3、orage.Thisapplicationnotedescribesthefollowingtopics:■“HandlingJ-LeadandQFPDevices”onpage1■“TransferringDevicesBetweenTubes”onpage13■“TransferringQFP,BGA,FBGA,andLidlessFBGADevicesWithoutCarriersBetweenTrays”onpage13■“DryPackingJ-Lead,QFP,BGA,FBGA,andLidlessBGADevices”onpage14■“Sh
4、ippingJ-Lead,QFP,BGA,FBGA,andLidlessFBGADevicesinBoxes”onpage19HandlingJ-LeadandQFPDevicesToprotectdeviceleadsandensureproperoperation,youmusthandleJ-LeadandQFPdevicescarefullywhentheyarestored,shipped,andtransferred.YoumuststoreandshipJ-Leaddevicesintubessealedwithstoppers.Addfoa
5、minsidethetubesforcushioningifnecessary.YoumustshipQFPdevicesincarriersonlyinsidetubessealedwithstoppersandwithfoam(ifnecessary).Carriersarestatic-dissipative,moldedplasticshellsthatholdQFPdevicesinasecureframetopreventmechanicaldamagetodeviceleads.YoucanprogramanderasetheseQFPdev
6、icesinsidecarriersandtheycantoleratethe125°Cbakingrequiredfordrypacking.WhenhandlingQFPdevicesincarriers,donottouchtheQFPdevice;onlyusefingerscotstotouchthecarrier.fIfyouarerequiredtoinsertaQFPdeviceintoacarrier,contactAltera®CustomerMarketing.FormoreinformationonQFPcarriers,refer
7、totheQFPCarrierandDevelopmentSocketDatasheet.©2011AlteraCorporation.Allrightsreserved.ALTERA,ARRIA,CYCLONE,HARDCOPY,MAX,MEGACORE,NIOS,QUARTUSandSTRATIXareReg.U.S.Pat.&Tm.Off.and/ortrademarksofAlteraCorporationintheU.S.andothercountries.Allothertrademarksandservicemarksaretheproper
8、tyoftheirrespectiveholdersasdescr
