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1、ABSTRACTThree-dimensionalNetwork-on-Chip(3DNoC),whichcombinesthebenefitsof3DintegratedcircuitsandNoC,issupposedtobetherevolutionarymethodologyformulti-layerson-chipdesign.Comparedwith2Darchitecture,3DNoCoffersanumberofadvantages,suchasshorterglobalinterconnects,lowerend-to-en
2、ddelay,higherthroughput,lowerpowerconsumption,higherpackingdensityandsmallerfootprint.Inthemeanwhile,3DNoCenablesfunctionaldiversificationbytheimplementationofmixed-technologywithoutincreasingthecomplexityofthedesign.However,3DNoCalsohastofacenewchallenges.Owingtotheimmaturit
3、yofthroughsiliconvia(TSV)technologyandthehighthermaldensity,moreattentionshouldbepaidtothechipyieldandtheefficiencyofheatdissipation.Therefore,thefocusofthisthesisishowtodesignanew3DtopologywhichcanmeettheperformancerequirementswithlowerTSVdensity,andhowtodesignanew3Droutinga
4、lgorithmwhichisabletoachievethermalbalance.Firstly,wesummarizedthedevelopmentofNoCandnewchallengesintroducedby3DNoC.Then,acomparisonaboutbusandpoint-to-pointlinkbasedinter-layercommunicationmechanismsisgiven.Toobtainsuitableapplicationbackground,a3DNoCsimulatorisdevelopedwith
5、OPNET.Accordingtothesimulationresults,theapplicationconclusionwasdrawn.Onthebasisoftheconclusion,point-to-pointlinkisselectedtorealizeinter-layercommunicationinthe3Dgeneralpurposemulti-coresprocessorwedesigned.TodecreasethenumberofTSVandimprovetheyieldofthechip,anew3Dtopology
6、whichsharesverticallinksthroughtheextraverticalrouterisdesigned.Thenewtopologycanbringa75%reductionofTSVnumberandmeettheperformancerequirementsatthesametime.Theareaandpoweroverheadarealsodecreasedsincetherouterweappliedwillnotincreasetheportnumber.However,3DNoChashigherpowerd
7、ensityandmayleadtohightemperaturenodes.Tolowerthermaldensity,wedesigneda3Ddeadlock-freeroutingalgorithmwhichisabletoachievethermalbalance.Accordingtothefeatureofheatdissipation,theroutingalgorithmenablesthetrafficdistributiongraduallyreducedfromthebottomlayertothetopone.There
8、fore,thelayerclosertotheheatsinkwillproducemorethermalwhichcanbecond
