多孔微热沉大功率led阵列传热仿真与实验的研究

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1、华中科技大学硕士学位论文down-emptystructureisfound.Fromthepointsofthechipsubstratetemperatureuniformity,installationconvenienceandeconomy,thedown-emptystructurewouldbethebestoption.ThepurposeofthisresearchistoofferareferencetheoryanddesignbasisforsolvingtheproblemofhighpowerLEDarray,whichc

2、ouldimprovethesustainabledevelopmentandapplicationofLED.Keywords:PorousMicroHeatSink;HighPowerLED;HeatTransfer;NumericalSimulation;StructureOptimization.III华中科技大学硕士学位论文目录摘要.........................................................................................................（

3、I）ABSTRACT.............................................................................................（II）1绪言1.1研究意义..........................................................................................（1）1.2LED的发展与研究现状......................................................

4、...........（2）1.3本文研究内容................................................................................（11）2多孔微热沉大功率LED阵列系统2.1多孔微热沉系统介绍....................................................................（13）2.2多孔微热沉系统实验...........................................................

5、..........（14）2.3本章小结........................................................................................（18）3多孔微热沉大功率LED阵列系统数值模拟3.1多孔微热沉系统数值仿真............................................................（20）3.2仿真结果与实验结果的对比验证................................................（2

6、2）3.3本章小结........................................................................................（23）4影响多孔微热沉系统散热性能因素研究4.1进出口数目对散热性能的影响...................................................（25）4.2工质流速对散热性能的影响........................................................（31）4.3孔隙率对散热性能的影

7、响............................................................（33）4.4环境温度对散热性能的影响........................................................（36）4.5本章小结........................................................................................（37）IV华中科技大学硕士学位论文5新型多孔微热沉结构数值仿真5.1下进平出型多孔微

8、热沉....................................................