ic型号命名方法参考

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1、IC型号命名方法参考点击次数：2088  更新时间：2007-11-51:19:01      MAXIM专有产品型号命名                                           MAX  XXX  (X) X X X                                          1       2     3   4 5 6                   1．前缀：MAXIM公司产品代号                   2．产品字母后缀：         

2、                     三字母后缀：C=温度范围； P=封装类型； E=管脚数                              四字母后缀：B=指标等级或附带功能； C=温度范围； P=封装类型； I=管脚数                   3．指标等级或附带功能：A表示5%的输出精度，E表示防静电                   4．温度范围：C=0℃至70℃（商业级）                                          I=-20℃至+85℃（工

3、业级）                                          E=-40℃至+85℃（扩展工业级）                                          A=-40℃至+85℃（航空级）                                          M=-55℃至+125℃（军品级）                   5．封装形式： ASSOP(缩小外型封装)                                    QPLC

4、C(塑料式引线芯片承载封装)                                        BCERQUAD                                                R窄体陶瓷双列直插封装(300mil)                                        CTO-220,TQFP(薄型四方扁平封装)                  S小外型封装                                        D陶瓷铜顶

5、封装                                             TTO5,TO-99,TO-100                                        E四分之一大的小外型封装                                 UTSSOP,μMAX,SOT                                        F陶瓷扁平封装H模块封装,SBGA                     W宽体小外型封装（300mil）  

6、                                      JCERDIP(陶瓷双列直插)                                  XSC-70（3脚，5脚，6脚）                                        KTO-3塑料接脚栅格阵列                                 Y窄体铜顶封装                                        LLCC(无引线芯片承载封装)         

7、                     ZTO-92MQUAD                                        MMQFP(公制四方扁平封装)                              / D裸片                                        N窄体塑封双列直插                                         /PR增强型塑封                                        

8、P塑封双列直插                                               /W晶圆                   6．管脚数量：                                        A:8                                  J:32K:5，68