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ID:33428505
大小:9.80 MB
页数:89页
时间:2019-02-25
《基于机器视觉的bga微焊球高度测量方法与系统的分析》由会员上传分享,免费在线阅读,更多相关内容在学术论文-天天文库。
1、硕+学位论文ABSTRACTTheBallGridArray(BGA)packageisakindofhighdensib.areaarrayadvancedpackagingtechnologySolderjointreliabiliqisighlvdependentonsolderballheightuniformiIy/coplanimty,soitisVCD"importanttomeasufetheheightofsolderballsonchipsAtpresent,packagingenterprisesneedakindofmicroso
2、lderbailheightinspectionequipmentwithfastspeed,moderateaccuracy,lowcostInthispaper.anovelprojectionmethodforsolderballhcightmeasurementwasproposedandamachinevisionsystemtorealizethismethodwasdesignedThemainresearchcontentswerelisted盐follows:1)AccordingtotheSEMimageofmicrobumpthei
3、dealsphericalcapassumptionofmicroBGAsolderballwasverified.Basedollthisassumption.atlcwprojectionmethodformeasuringsolderballhcightWaSproposedUndertheilluminationofaparallellightbeamTheinfluencefactorsonheightmearurementresults'wereanalyzed,suchaslightincidentangle,ballradius.andl
4、engthofshadowAimagingmethodusingalow-angleLEDringlightsourceandawhiteLEDdotlightsourcewasdesigned2)Forthesolderballimageandshadowimage.thecontourofsolderballandshadowwereex【ractedthroughfilteringautomaticsegmentatinnusingOtsuthresholdmethod,halefilling.contourexlxactionThesolderb
5、agandshadoweoniolArwasproposedbasedoncircle,elhpsefining.respectivelyExperimentalresearchshowtheimageprocessingalgorithmisefficientandstable3)Anautomaticmicrobumpheightinspectionsystembasedonmachinevisionwasconstructedwithaself-designedmachinestructure.controlcircuitandcontralsof
6、i3varedevelopedbyOpenCV&VisualCHnemicrosolderballwithheightofabouthundredsofmicroswasmeasuredauomaicly4)Theeffectofchiptranslation.rotation.substratematerial.andthewarpageofsubstrateonmicrosolderballheightmeasurementresultswerestudiedExperimentsandtheoreticalresearchshowthatthesu
7、bstrateXdirectionwarpageisthemainaspecttoinfluenceheightresults.astheXdirection,,varpagechangedtheanglebetwcenthesubstrateandtheincidentlightAccordingtotheheightdistributioncharacteristicsofheightresultsanautomaticcompensationalgorithmwaspresentedKEYWORDSMachinevisionBGA.Heightin
8、spectionOpticalshadow,Imageprocessing硕士学
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