基于饱和压降测量的igbt功率模块状态评估方法分析

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1、重庆大学硕士学位论文英文摘要temperaturebydesignsinglepulsetemperaturecabinetexperimentalplatform．ThencombinedwithexperimentandsimulationinSaber，thethesisdemonstratesthecorrectnessofthemethoditapplied．⑨ToacceleratethechangingofIGBTjSstate，thethesisdesignedanaccelerat

2、edageingexperimentalplatform．TheprocedureisthatatfirstlargecurrentisappliedtodevicestoensureapromptriseofjunctiontemperaturetoreachitsmaximvaluecausedbytheconductionlossofIGBTandthencompulsorycoolingtodevicesisconductedafterinterruptofpowersupply．Asare

3、sult，junctiontemperaturewillfluctuaterapidlyinalargerangetobringaboutgreatthermalstresstothemodule，whichrealizesacceleratedagingofbondwiresandsolderlayers．Theplatformlayssolidfoundationforupcomingstateassessmentresearches．④Becausethereisyetnostandardiz

4、edproductsindomesticmarketandlongdurationofmanufacturing，thethesisadoptedanothermethodtOimitatechangesofacceleratedaging．First，unsealthemoduleandthecutoffpartofftheparalleledbondwiresOilIGBTchiptoapproximatethechangesledbynormalacceleratedaging．Threedi

5、mensionalsurfaces圪esat项厶，rj)arecomparedbeforeandafterthecuttingofbondwires．Basedontheanalysisofthedifferencebetweenthetwosurfaces，thethesissummarized：changesofsaturationvoltagedrop『／cesatatcertainoperatingpointcanbeatruereflectionofchangesinthemodule’S

6、state．Aftercomparingthismethodtoapreviousmethod，wegot：thismethodcanavoidamiscarriageofjusticeinonthehealthstatuSofthedevices．Keywords：InsulatedGateBipolarTransistor，JunctionTemperatureMeasurement，StateAssessment，AcceleratedAging，SaturationVoltage重庆大学硕士

7、学位论文目录目录中文摘要⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯■⋯⋯⋯⋯⋯．．I英文摘要⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯j⋯⋯⋯⋯⋯⋯⋯⋯III1绪论⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯．．11．1研究背景及意义⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯．11．2状态评估的国内外研究现状⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯．51．2．1国内研究现状⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯51．2．2国外研究现状⋯⋯⋯⋯⋯⋯

8、⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯61．3本文研究内容⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯．92IGBT模块的老化失效与状态评估的关系及结温的影响⋯⋯⋯⋯⋯112．1引言⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯112．2IGBT模块的老化失效机理⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯．112．2．1与模块封装有关的失效⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯一112．2．2与芯片有关的失效⋯