封装工艺中的铜线键合分析

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1、上海交通大学硕士学位论文RESEARCHONTHECOPPERWIREBONDINGINPACKAGINGPROCESSABSTRACTInthisarticle,Iexpoundedthecopperwireencapsulationtechnologyresearchstatus,studyedanddemonstratedthepossibilitythatcopperwireinsteadinggoldwirethenbecomethemainpackagingprocessinthesemiconductorpackagingtechnologythroughreadingal

2、argenumberofsemiconductorpackagingtechnologymaterials,copperwirepackagingreliabilityrelatedliterature.Isummarizedsomekeyproblemsoftheapplicationandthemethodofhowtosolvetheseproblemincopperwireencapsulationtechnologycombinedwithpracticalwork’sachievement.Problemssuchascopperoxideandintermetallicco

3、mpound(IMC).CopperwireisfacingtheFABfreeballshaping,chipbondingplatealuminumextrusion,bondingpadcraterandthebondingrelateddetectionmethodsproblemafterpackagingcompletionrelativetogoldbecauseofthehighhardnessproblem.Ioptimizedtheprocessfortheballandwedge,gavetherecommondedparametersetting,evaluate

4、dcopperwirebondingresultthroughproductreliabilityandfailureanalysis.AlsoIanalyzedthelatestmaterialpalladium’srelatedtechnologyadvantagesanddisadvantageswhich’scostbetweenbarecopperandgoldwire.IncludingtheFAB(FreeAirBall)’srepeatability,edm(EFO)influenceontheresultofthecurrentoftheweldinglayer,alu

5、minumsplash.Thewedgebonding’sperformance,thechangeoftheparameter’srange,copperwirebondingreliabilitytestresults,etc.KEYWORDS:Cuwirepackaging,CopperwirebondingReliability,PdCuwireII万方数据上海交通大学硕士学位论文目录摘要...............................................................I第一章前言............................

6、.............................11.1课题研究的目的意义.............................................11.2课题的研究方法.................................................31.3引线键合工艺简介...............................................4第二章铜线键合的优劣势及目前存在的问题.............................72.1铜线键合的优势...............................

7、..................72.2铜线键合工艺面临的主要问题....................................82.2.1易于氧化问题.................................................................................................82.2.2硬度大带来的问题........................