衬垫单面焊的数值模拟

衬垫单面焊的数值模拟

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时间:2019-02-19

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1、afterwelding.Studythetemperaturechangeswithtimeofnodesinfiniteelementmodelandtheevolutionprocessofstressoncrosssectionofweldment.Simulatedthedistributionofresidualstressindifferentweldinglineenergy,theresultsshowedthathigherweldinglineenergyused,highers

2、tresspeakinresidualstressarea,asaresult,thedistancebetweenresidualstressareaandweldseamwillbeincreased.Analysandstudytheregularitiesofdistributionofresidualstressalongthedirectionofweldseamandverticaldirectionofweldseam.Simulatedthehightemperaturetemper

3、ingheattreatmentofweldmentwhichiscoolingtoroomtemperatureafterwelding,comparisonofthedistributonandvaluechangeofresidualstressbeforeheattreatmentandafterheattreatment.Theresultsshowedthatthedistributionofredidualstressalmostunchanged,butthevalueofresidu

4、alstressaregreatlyreduced.Keywords:one-sideweldingwithbacking,heatsourcemodel,temperaturefield,redidualstress,heattreatmentiii万方数据目录摘要.......................................................................................................................

5、...........................iAbstract..........................................................................................................................................ii目录...........................................................................

6、.......................................................................I第一章绪论...................................................................................................................................11.1陶质衬垫单面焊技术................................

7、......................................................................11.2数值模拟在焊接领域的应用..........................................................................................21.3焊接数值模拟的研究发展与现状...........................................................

8、........................31.4焊接数值模拟存在的问题..............................................................................................41.5焊接数值模拟的发展趋势.................................................................................

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