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ID:33013260
大小:3.37 MB
页数:65页
时间:2019-02-19
《ka波段谐波镜像抑制混频器mmic设计》由会员上传分享,免费在线阅读,更多相关内容在行业资料-天天文库。
1、ABSTRACTABSTRACTMonolithicMicrowaveIntegratedCircuits(MMIC)hasmanyadvantagessuchassmallsize,highreliability,lowparasitic,goodconsistenceandlowcostwithmass-production.Soitisthemostattractivechoiceforbothmilitaryandcivilcommunicationsystems.Millimeter-wavemixerisakeypartinT/Rcomponents,andtheimag
2、erejectionmixercanperformwellintheconditionoflowIFsignalandbroadband.ConsideringthedifficultiesandcostofhighfrequencyLO,harmonicmixerisagoodsolutiontotheseproblemwiththefrequencyofLOdownto1/2or1/4ofitself.Inthedesignofsecondharmonicimagerejectionmixer,theinputportofLOandRFaredoublebalunandlange
3、bridgerespectively.LOsignalisinputthroughbalunandmixedwithRFsignaltowipeoffoddharmonicmixfrequency.Thefinalsimulationresultpresentsthattheconversionlossis11~11.7dBandtheimagerejectionisabove26dBinthebandof35-37GHzwhilethefrequencyofIFisfixedtof0.Inthedesignofforthharmonicimagerejectionmixer,the
4、inputportofLOandRFareWilkinsonpowerdeviderandlangebridgerespectively.Thefinalsimulationresultpresentsthattheconversionlossis12.2~13.7dBandtheimagerejectionisabove28dBinthebandof34-36GHzwhilethefrequencyofIFis0-1GHz.Andthemeasuredresultpresentsthattheconversionlossis12~16dBandtheimagerejectionis
5、above16dB.Keywords:Kaband,harmonicimagerejectionmixer,doublebalun,langebridge,MMIC.II万方数据目录目录第一章引言....................................................................................................................11.1研究意义及背景......................................................................
6、..........................11.2国内外发展动态................................................................................................21.2.1国外发展动态..........................................................................................21.2.2国内发展动态................................................
7、..........................................31.3课题介绍............................................................................................................41.3.1技术指标..............................................................
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