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ID:32995195
大小:2.44 MB
页数:58页
时间:2019-02-18
《fpga芯片互连线测试》由会员上传分享,免费在线阅读,更多相关内容在行业资料-天天文库。
1、代号10701学号1078490726分类TN4密级公开号题(中、英文)目FPGA芯片互连线测试TheInterconnectTestforFPGAChip作者姓名吴九欢指导教师姓名、职务吕红亮教授学科门类工学学科、专业软件工程提交论文日期二〇一三年一月AbstractAbstractThedevelopmentofintegratedcircuittechnologymakethefield-programmablegatearray(FPGA)havelargerscale、strongerfunctionsandricherinternalresour
2、cesaswellasgreatertestingdifficulty.Onthechip,programmableinterconnectresourcewhichbeartheinterconnectionandthesignaltransmissionbetweenlogicblocksisthemostcomplicatedandlargestmodule.Itaccountsfortheproportionoftheresourcesofthewholechipevenmorethan70%.Theprogrammableinterconnectr
3、esource’shighflexibilityandlargescalemakeitstestingmethodhasalwaysbeentheemphasisanddifficultyintheFPGAtestingmethodstudyfield.Thestudyobjectofthispaperistheinterconnecttest.Firstlythispaperdescribedthestructure’sfeatureoftheinternalinterconnectresourcesindetailaswellastheinterconn
4、ection’srelationship.Thedescriptionwhichprovidessupportforthefollow-upstudyfocusonthesingleline,hexlineandlongline’sconnectionandswitchmatrix’scircuitstructure.Andaccordingtothecircuitstructure,asetoffaultmodelhavebeenputforward.Thefaultmodelhascoveredseveralcommonfailuretypesbasic
5、allywhichoftenappearedintheactualcircuitandalsohasbeenoptimizedatthesametime.Thenaseriesoftestingpathshavebeendesignedafterconsideringthefaultmodelandinterconnectionlaw.Inadditiontomeetingthedemandofresourcecoverageandfaultcoverage,thisseriesoftestingpathisalsoverypracticalandeasyt
6、oimplementatthesametime.Finally,twokindoftestingplanhavebeendesignedforthepurposeofproductiontestaswellasdiagnostictestandtheinterconnecttesthavebeencompletedactually.Theexperimentalresultsshowthatthistestingschemenotonlycanobtainhigherresourcescoverageandfaultcoverage,butalsohassi
7、mpleandpracticalfeatures.So,thisinterconnecttestinghasachievedtheexpectedresult.Keywords:FPGAFaultModelTestingPathInterconnectTest目录目录摘要...................................................................................................................................5Abstract......
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