代甲醛还原剂pcb基材化学镀铜分析

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1、堡主兰堡堡苎————————堕关键词：化学镀铜，羟甲基磺酸钠，乙醛酸，添加剂，印制线路板硕士学位论文ABSTRACTItishighlydesirabletoreplacetheconventionalelectrolesscopperplatingsolutionusingformaldehydeasthereductantduetotheissuesofenvironmentalprotection．Twoofthemostattractivecandidatesaresodiumhypophosphiteandglyoxylicacid．However，themajorchallen

2、gefortheirwideapplicationisthatsodiumhypophosphitecannotbeself-catalytic，andthenickelintheas—depositedcopperlayerincreasestheresistanceofthefilmMeanwhile，glyoxylicacidisexpensive．Therefore，reducingfreeformaldehydeoverflowisafavorablemethod．Inthisthesis，weusedhydroxylmethylsulfonicacidsodiumandglyo

3、xylicacidascompositereductants，andintensivelyinvestigatedtheplatingparametersandthecorrespondingproperties．Theresultsshowedthatbyusingcompositereductantsthedepositionratewashigh，thebathwasstable，andCucoatingwithsmoothappearanceandgoodadherencetothesubstratewasobtained．Theoptimalconditionsofelectro

4、lesscopperplatingsolutionweredetermined．ThecompositionsofthebathusedwereasfoIlows：coppersulfate(0032m01)，sodiumhydroxide(O．375mol／L)，formaldehyde(0．0136mol／L)，sodiumsulfite(0036mol／L)，glyoxylicacid(0．0263moI／L)，disodiumethylenediaminetetraacetate(0．046mol／L)，tartaricacidpotassiumsodium(0．028mol／L)

5、，2，2

6、nyadditiveswasmeasuredasthebasicsolution．Onconclusion，thecathodicreductionofcopperwaspromotedbyincreasingtheconcentrationofcoppersulfateandsodiumhydroxide；hydrogenevolutionreactionofadsorbedhydroxylmethylsulfonicacidsodiumandglyoxylicacid，andoxidationdissolutionreactionofanodecopperwerepromotedbyi

7、ncreasingsodiumhydroxide；thedissolutionofthecopperwasinhibitedbyincreasingthe硕士学位论文concentrationofglyoxylicacidControlledexperimentshavebeenconductedtoinvestigatetheinfluenceofsingleadditiveandcompositeadditives．