《pcb多层板制程》ppt课件

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1、PCB多層板製程介紹PCBAME1/54課程綱要PCB多層板結構材料PCB多層板製程內層板壓合，鑽孔電鍍，外層板表面處理成型，成檢2/54PCB多層板3/54PCB多層板4/54外形術語及尺寸單位多層板Multi-layer層數layercount:Cu層數內層innerlayerEx.L2/L3,L4/L5外層outerlayer零件面ComponentsideEx.L1銲錫面SoldersideEx.L6外尺寸長度寬度Ex.20"x16"板厚Ex.63mil(條)=1.6mm尺寸單位英吋inch1inch=1000mil=25.4mm英絲mil1mi

2、l=0.001inch=0.0254mm=25.4m5mil=0.005inch=0.125mm=125m1mm=39.37mil5/54多層板結構通孔ThroughHole孔徑孔環AnnularRing絕緣介質層Dielectric線路線距線寬內層2內層1傳統多層板增層法多層板6/54結構術語及尺寸單位導通孔ViaHole連接各層電路孔徑Ex.機鑽通孔0.3mmEx.雷射盲孔6mil孔環AnnularRingEx.單邊+5mil縱橫比AspectRatio板厚/孔徑鑽孔,電鍍能力孔間距100mil=2.54mm50mil=1.27mm線路Power

3、/Ground層信號層Signallayer線路Conductor焊墊Pad線寬/線距(L/S)LineWidth/LineSpace6/6=150/150m5/5=125/125m4/4=100/100m孔間(100mil)過几條導線8/8→過2條6/6→過3條5/5→過4條7/54多層板材料-銅箔基板銅箔基板CCLCopperCladLaminate基板尺寸(inch)36x48,40x48,42x48基板厚度(mm)不含銅:0.1,0.15,0.2,0.25,0.3,0.38,0.53mm含銅:0.8,0.9,1.0,1.2,1.

4、6,2.0,3.2mm銅箔(oz/oz)H/H,1/1,2/2膠片PP玻纖布補強材含浸樹脂(Astage)例：內層板4L:1.0mm,1/112L:0.1mm,H/H銅箔膠片PP8/54多層板材料-銅箔/膠片銅箔(CopperFoil):電鍍銅Purity99.8-99.9%重量厚度0.5oz/ft2(153g/m2)halfoz0.0007in(0.7mil,18m)1.0oz/ft2(305g/m2)0.0014in(1.4mil,35m)2.0oz/ft2(610g/m2)0.0028in(2.8mil,70m)膠片(PP,Prepreg):

5、Bstage代號厚度ResinContentResinFlow1061.6mil10802.5mil62+/-3%38+/-5%21164.0mil52+/-3%31+/-5%76287.0mil42+/-3%21+/-4%9/54常用基板材料FR:FlameResistant耐燃CEM:CompositeEpoxyMaterial複合樹脂材料10/54基板材料特性介質常數DielectricConstant(Dk)FR-4:~4.4愈低速度愈快散逸因子DissipationFactor(Df)LosstangentFR-4:0.035↓愈低高頻損失愈少

6、玻璃態轉化溫度GlassTransitionTemperature(Tg)FR-4:~135°C愈高安定性愈佳抗撕強度PeelStrength1ozCu:8lb/in↑銅箔附著強度11/54多層板製程12/54裁板銅箔基板磨邊導角內層剝膜內層蝕刻內層顯像內層曝光乾膜貼合前處理內層AOI疊板壓合黑/棕氧化鍍一次銅化學鍍銅除膠渣去毛邊鑽孔乾膜貼合鍍二次銅前處理外層曝光外層顯像鍍錫鉛外層剝膜外層蝕刻噴錫鍍鎳金文字印刷文字烘烤塞孔印刷防焊後烤綠漆顯像防焊預烤防焊塗佈前處理防焊曝光成品檢查斜邊成型真空包裝成品清洗V-Cut電測剝錫鉛外層AOI典型多層板製程Mult

7、i-LayerProcess基板處理內層製程壓合鑽孔鍍銅外層製程防焊製程表面處理檢驗成型13/54基板裁切發料，裁板Ex.40“x48”→6片20"x16"Ex.42“x48”→4片24"x21"磨邊導圓角基板烘烤使樹脂完全硬化→CStage加溫至Tg點以上CMO-8W(S),加台車,水平送風Ex.180~210C,120min14/54內層板與壓合15/54內層板與壓合製程InnerLayerImageTransfer&Lamination剝膜蝕刻顯像曝光除塵靜置撕膜內層AOI內層檢測烘烤內層黑化PP銅箔壓合疊板X-Ray鑽靶拆板成型沖孔乾膜貼合前處

8、理冷卻除塵微蝕預熱+內層板++16/54板面前處理Pre-Treatment刷磨