PCB 板各种厚度规格汇总.pdf

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PCB板材厚度规格：0.5mm，0.7mm，0.8mm，1.0mm，1.2mm，1.5mm，1.6mm，2.0mm，2.4mm，3.2mm，6.4mmPCB板上铜箔的厚度规格：18um,25um,35um,70um和105um常用半固化片规格：型号10802116L2116A2116H15007628L7628A7628H7628M厚mil344.55677.59.38板厚一般分为含铜和不含铜两种厚度一．含铜厚度：规格配料结构规格配料结构0.1H/H1×1061/16×76281.31/11×2116H/H7×7628H/12×10802/27×76280.2H/H1×15061.41/17×7628T/T1×7628H/H7×76282/21×1062/27×76282/21×15061/18×76281.5H/21×7628H/H8×76281/12×2116T/T8×76280.3H/12×21162/28×7628H/H1080+2116+10801.61/18×7628T/T1080+2116+1080H/H8×76282/21080+2116+10802/28×76281/11080+7628+10800.41.7H/H2×76281/19×7628T/T2×7628H/H9×76282/22×76282/29×76280.51/17628+1080+76281.81/19×7628H/H7628+1080+7628H/H9×76282/27628+1080+76282/29×76280.61/13×76281.91/110×7628H/H3×7628H/H10×76282/23×76282/210×76280.71/12116+2×7628+21162.01/110×7628H/H1080+3×7628+1080H/H11×76282/21080+3×7628+10801/111×76282.20.81/14×7628H/H12×7628H/H4×76282/212×76282/24×76282.31/112×76280.91/12×7628+1080+2×7628H/H12×7628H/H2×7628+2116+2×76282/212×76282/22×7628+2116+2×76282.41/113×76281.01/15×7628H/H13×7628H/H5×76282/213×76282/25×76282.51/113×76281.11/15×7628H/H13×7628H/H6×76282/216×76282/26×76283.01/116×76281.21/16×7628H/H16×7628H/H6×76281/117×76283.22/217×7628 二．不含铜厚度厚度mil厚度mm配料结构备注20.0501×106不含2OZ铜箔30.075~0.076主:1×1080次:1×1086不含2OZ铜箔厚度mil厚度mm配料结构备注40.10~0.102主:1×2116次:1×3313或2×106或1×2113或1×2313或1080+10650.127主:1×2116次:2×108060.150~0.152主:1×1506次:2×108070.178主:1×7628次:1080+211680.200~0.203主:1×7628次:2×2116或2×211390.228~0.2302×2116100.25~0.2542×2116110.280主:1080+2116+1080次:2×2165120.300~0.305主:2×1506次:2116+1080+2116130.33主:1080+7628+1080次:2×1506140.356~0.362×7628150.382×7628160.406~0.41主:2×7628次:3×2116170.43主:7628+1080+7628次:2×7628180.457~0.467628+1080+7628190.487628+2116+7628200.508~0.51主:7628+2116+7628次:7628+2×1080+7628或3×7628210.533×7628220.563×7628230.583×7628240.60~0.61主:3×7628次:2116+2×7628+2116250.64主:3×7628次:2116+2×7628+2116260.661080+3×7628+1080270.691080+3×7628+1080280.71~0.711主:4×7628次:4×7628300.764×7628310.79~0.804×7628友情备注：1foot=12inch=304.8mm1inch=25.4mm1mil=0.0254mm1inch=1000mil1OZ=28.375g1OZ铜箔其真正厚度为1.38mil或35μm 一、芯板、半固化片规格：1．生益芯板常见规格：0.1mm（含铜厚）0.2mm~5.120.3mm~9.060.4mm~12.990.5mm~16.930.6mm~20.870.7mm~24.80.8mm~28.740.9mm~36.611mm~44.491.2mm~52.361.5mm~56.31.6mm~60.242mm~75.982.4mm~91.732．半固化片：1080~3.0mil2116~4.2mil7628~7.0mil3．流胶厚：1080~2.5mil7628~6.5mil0.14mm=2*10800.21mm=2*21160.24mm=7628+10800.36mm=2*76280.4mm=2*7628+1080二、常用半固化片在不同铜厚、不同图形厚度变化：1．HOZCopper/gndGnd/gndCopper/signalGnd/signalSignal/signal76287.37.06.86.76.621164.64.44.24.03.833133.93.83.73.53.310802.82.62.52.42.27628H7.67.37.17.06.92116H4.94.74.54.34.13313H4.14.03.93.73.51018H2.92.72.62.52.37628C7.16.86.66.56.43313C3.73.63.53.23.1 2．1OZCopper/gndGnd/gndCopper/signalGnd/signalSignal/signal76287.16.86.66.56.421164.54.34.13.93.733133.83.73.63.43.210802.82.62.52.42.27628H7.47.16.96.86.72116H4.84.64.44.24.03313H4.03.93.83.63.41018H2.92.72.62.52.37628C6.96.66.46.36.23313C3.63.53.43.23.03．2OZCopper/gndGnd/gndCopper/signalGnd/signalSignal/signal76286.86.56.36.16.021164.24.03.83.53.333133.53.43.33.12.810802.62.42.32.11.97628H7.16.86.66.46.32116H4.54.34.13.83.63313H3.73.63.53.33.01018H2.72.52.42.22.07628C6.66.36.15.95.83313C3.33.23.12.92.64．3OZCopper/gndGnd/gndCopper/signalGnd/signalSignal/signal76286.56.26.05.75.621164.03.83.63.23.033133.33.23.12.82.510802.42.22.11.81.67628H6.86.56.36.05.92116H4.34.13.93.53.33313H3.53.43.33.02.71018H2.52.32.21.91.77628C6.36.05.85.55.43313C3.13.02.92.62.3注：Gnd为65%以上的大铜箔，H为高树脂含量，C为低树脂含量。 S0401粘结片压合厚度（100％残铜率）指标压合厚度压合厚度树脂含量μm/±20μmMil规格10671±3502.0±0.41080L61±3712.8±0.41080A64±3783.1±0.41080H68±3903.5±0.42116L50±31134.4±0.62116A52±31204.7±0.62116H56±31335.2±0.6331355±31004.0±0.67628L41±31857.3±0.87628A43±31957.7±0.87628M46±32108.3±0.87628H50±32309.1±0.81506A45±31606.3±0.81506H49±31756.9±0.8S0701粘结片压合厚度（残铜率100%）指标压合厚度压合厚度树脂含量μm/±20μmMil规格10671±3512.0±0.41080L61±3722.8±0.41080A64±3803.1±0.41080H68±3923.6±0.42116L50±31154.5±0.62116A52±31214.8±0.62116H56±31355.3±0.6331355±31024.0±0.67628L41±31887.4±0.87628A43±31987.8±0.87628M46±32138.4±0.87628H50±32359.3±0.81506A45±31626.4±0.81506H48±31756.9±0.8 S1000B粘结片压合厚度（残铜率100%）指标压合厚度压合厚度树脂含量μm/±20μmMil规格10671±3471.9±0.41080L63±3712.8±0.41080A66±3783.1±0.41080H68±3833.3±0.42116L52±31124.4±0.62116A55±31214.8±0.62116H58±31325.2±0.6331355±3943.7±0.67628L43±31857.3±0.87628A46±31987.8±0.87628M48±32078.1±0.87628H50±32188.6±0.81506A45±31515.9±0.81506H48±31626.4±0.8S0155粘结片压合厚度（100%残铜率）指标压合厚度压合厚度树脂含量μm/±20μmMil规格10671±3491.9±0.41080L62±3722.8±0.41080A65±3793.1±0.41080H68±3883.6±0.42116L51±31144.5±0.62116A53±31204.7±0.62116H56±31305.1±0.6331356±31004.0±0.67628L42±31877.4±0.87628A44±31967.7±0.87628M46±32058.1±0.87628H50±32278.9±0.81506A45±31566.1±0.81506H48±31686.6±0.8 以上压合厚度谨供贵司参考，因为具体压合后厚度还与贵司生产的PCB的铜厚、线路等有关，所以以上数据仅为贵司提供一个参考，制成PCB后的具体数据还以贵司实测值为准。