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1、重庆理工大学硕士学位论文II万方数据AbstractAbstractWiththerapiddevelopmentoftheelectronicinformationindustriesintheworld,electronicpackagingmaterialshaschangedfromleadsoldertolead-freesolder.While,theincreasingamountoftinelementinthelead-freesolderandthehighertemperatureinbrazingsolderleadtoth
2、eaggravationofthesolderoxidationproblem.Toomanyoxideslagwillnotonlywastethesolder,increasethecostofproduction,butalsoaffectthebrazingqualityofelectronicproducts.Therefore,howtocontroltheformationofoxideslagintheproductionandapplicationofsolderproductshasbeenaveryimportantresea
3、rchsubjectonlead-freesolderfieldtodomesticandoverseasscholars.ThispaperchoosestheSn-4Culead-freesolderwhichhasbeenwidelyusedinmanufactureself-fluxingenameledwireasamainresearchsubject.Inthispaper,themainpurposeistoimprovetheanti-oxidationperformanceofSn-4Culead-freesolderonthe
4、basisofvariousinvestigationsinthemeltingcharacteristic,micro-structureandcomposition,technologicalperformanceandinterfacemicrostructureofSn-4Culead-freesolder.BasedonstudyingtheeffectsofPandGaonoxidationresistanceandwettabilityofSn-4Culead-freesolder,weoptimizedSn-4Cu-0.01P-0.
5、03Gasolderwithabettercomprehensiveperformance..TheresultsinthispapershowthatthesmalleramountofPobviouslyimprovestheanti-oxidationperformanceofSn-4Culead-freesolder,theoxidateslagSn-4Cu-0.01Pproducedinstaticskimmingexperimentisonly63.8%ofSn-4Cuwhenthetemperatureis380℃.,butithas
6、alittleinfluenceonthewettingperformance.ThebestamountofGaintheSn-4Culead-freesolderis0.03wt%,theoxidateslagformationofGa-addedsolderalloydecreasesby52.8%.Meanwhile,Gaisadditiveelementonincreasingwettability.Theanti-oxidationperformanceofSn4Cu-0.01P-0.03GaisbetterthanSn-4Cu-0.0
7、1PandSn-4Cu-0.03Ga,buttherateofextensibilityhasnoobviouschangeforthesolderoncopper.BymeansoftheX-rayanalysisontheoxidateslag,theresultsshowthatSnOisthemajoroxidesofSn-4Culead-freesolder.Withoxyphilicskineffect,traceanti-oxidationP、Gaelementsenrichedinthesurfaceofmoltenlead-fre
8、esolder.Accordingtothermodynamiccalculations,theenrichedP、Gae
