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1、表面组装技术复习题（Reviewofsurfacemounttechnology）Chapter1:Introduction1.whatisthesurfacemounttechnology(SMT):withoutinsertingholeontheprintedcircuitboarddrill,directlytothesurfacemountmicrocomponentsweldedtoaprintedcircuitboardorothersubstratesurfaceprovidesadvancedelectronicpositionassemblytechnology.2.w
2、hatisthesurfacemounttechnology(THT):thesurfacemountcomponentmountedtotheboreholePCB,afterreflowsolderingortoformareliablemechanicalandelectricalconnectionbetweenthecircuitcomponentsandsurfacemountedPCBplate.WhatadvantagesdoesSmt3.havecomparedwiththt?4.,SMTtechnologysystemcovers:mechanical,electron
3、ic,optical,material,chemical,computer,network,automaticcontrol.5.fromatechnicalpointofview:SMTtechnologyisacomponent,printedboard,SMTdesignandassemblyprocess,equipment,materialsandinspectiontechniques,suchascompositetechnology.The6.substrateisastructuralcomponentinterconnectedbycomponents,andplays
4、animportantroleinensuringtheelectricalperformanceandreliabilityoftheelectronicassembly.7.,thecoretechnologyofinformationindustry,chipmanufacturingindustry,hasenteredourcountryandlaidasolidfoundationforthesustainabledevelopmentofSMTtechnologyinchina.8.countriesintheworldinordertopreventSMTtechnolog
5、ygapbetweentheexpansionofdecision-making:tostrengthenscientificresearchandbasicresearch.8.,inthedevelopmentofSMT,thesurfaceassemblytechnologyhasbeendevelopedtowardhighdensity,fine,highflexibility,highreliabilityandvariety.9.electroniccomponentselectronicinformationequipmentcellplatecircuitassembly
6、technologyisthebasisformanufacturingelectronicequipment.Theemergenceofdifferenttypesofelectroniccomponentsalwaysleadstoarevolutioninthetechnologyofboardlevelcircuitassembly.10.,SMTinvolvesnotonlyelectronicequipmentandequipmentmanufacturing,butalsocomponentsmanufacturing,PCBmanufacturing,materialsm
7、anufacturingandmanufacturingprocessequipmentmanufacturing,butultimatelyservicesforelectronicmanufacturing.11.assemblyprocessandequipmentarethetoolsandmeanstoimplementSMTproducts,whichdeterminetheproductionefficie
