手机外壳的设计、制造及工艺

手机外壳的设计、制造及工艺

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时间:2018-08-06

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2、signGuideForThinWallProductsMaterialselectionRequirementThickThinHighFlowLengthResinFlowlength:SpiralFlow(L/T)100:1~150:1>200:1HighImpactStrengthNotchIzodImpactTest,LowTemperatureImpactTestGoodAppearanceLowGloss,UVResistance:deltaE1~2NeatengineeringPlastics:FlexuralModulus-2,000MPaStiffnessReinfo

3、rcedplastics:FlexuralModulus-3,500~14,000MPaHeatResistanceULRelativeThermalIndex(RTI):70~95oCMechanicalIntegrityDesignforassembly:Snapfit,SmallScrew,UltrasonicWeldingFlameResistanceMobilePhone:ULHB,PortablePC:UL94V-0~V-1CheilIndustriesInc.R&D,ApplicationDevelopmentCenter3LastUpdatedDEC071999Desig

4、nGuideForThinWallProductsShrinkageAmorphousvs.semi-crystallineSpecificvolume(cm(semi-crystallinepolymer)(amorphouspolymer)3/g)TgTmTemperature(oC)CheilIndustriesInc.R&D,ApplicationDevelopmentCenter4LastUpdatedDEC071999DesignGuideForThinWallProductsShrinkageNeatplasticmaterialstendtoshrinkmorealong

5、thedirectionofflowGateOrientationeffectsMoldshrinkageofReinforcedmaterialsisrestrictedalongthedirectionoffiberorientationCheilIndustriesInc.R&D,ApplicationDevelopmentCenter5LastUpdatedDEC071999DesignGuideForThinWallProductsMechanicalIntegrityReinforcedPlasticsLarger&thickwallpart2.0mmMechanicalIn

6、tegrity1.2mmSmaller&ThinwallpartOptimumpartdesign-optimizepartgeometryAdvancedAssembly-useproperassemblytechniqueCheilIndustriesInc.R&D,ApplicationDevelopmentCenter6LastUpdatedDEC071999DesignGuideForThinWallProductsRibs2.0mm1.2mmW<0.6TW0.25od>0.5oWallThicknessofRib,Boss,Gussetinthinwallpartma

7、ybesameaspartthicknessbecauseoflowpossibilityofsinkorvoid.GuidelinesforRibdimensions:Componentswallthickness:TDraftperside(d):0.5o~1.5oRibheight(H):lessthan5T(typically2.5T~3T)Ribspacing(oncenter):morethan(2T~3T)Basera

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