电子专业英语新手必备词汇

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1、printedcircuit印制电路printedwiring印制线路printedboard印制板printedcircuitboard印制板电路printedwiringboard印制线路板printedcomponent印制元件printedcontact印制接点printedboardassembly印制板装配board板rigidprintedboard刚*印制板flexibleprintedcircuit挠*印制电路flexibleprintedwiring挠*印制线路flushpr

2、intedboard齐平印制板metalcoreprintedboard金属芯印制板metalbaseprintedboard金属基印制板mulit-wiringprintedboard多重布线印制板moldedcircuitboard模塑电路板discretewiringboard散线印制板microwireboard微线印制板buile-upprintedboard积层印制板surfacelaminarcircuit表面层合电路板B2itprintedboard埋入凸块连印制板chiponb

3、oard载芯片板buriedresistanceboard埋电阻板motherboard母板daughterboard子板backplane背板bareboard裸板copper-invar-copperboard键盘板夹心板dynamicflexboard动态挠*板staticflexboard静态挠*板break-awayplanel可断拼板cable电缆flexibleflatcable(FFC)挠*扁平电缆membraneswitch薄膜开关hybridcircuit混合电路thickf

4、ilm厚膜thickfilmcircuit厚膜电路thinfilm薄膜thinfilmhybridcircuit薄膜混合电路interconnection互连conductortraceline导线flushconductor齐平导线transmissionline传输线crossover跨交edge-boardcontact板边插头stiffener增强板substrate基底realestate基板面conductorside导线面componentside元件面solderside焊接面p

5、rinting印制grid网格pattern图形conductivepattern导电图形non-conductivepattern非导电图形legend字符mark标志basematerial基材laminate层压板metal-cladbadematerial覆金属箔基材copper-cladlaminate(CCL)覆铜箔层压板compositelaminate复合层压板thinlaminate薄层压板basismaterial基体材料prepreg预浸材料bondingsheet粘结片p

6、reimpregnatedbondingsheer预浸粘结片epoxyglasssubstrate环氧玻璃基板masslaminationpanel预制内层覆箔板corematerial内层芯板bondinglayer粘结层filmadhesive粘结膜unsupportedadhesivefilm无支撑胶粘剂膜coverlayer(coverlay)覆盖层stiffenermaterial增强板材copper-cladsurface铜箔面foilremovalsurface去铜箔面unclad

7、laminatesurface层压板面basefilmsurface基膜面adhesivefaec胶粘剂面platefinish原始光洁面mattfinish粗面lengthwisedirection纵向crosswisedirection模向cuttosizepanel剪切板ultrathinlaminate超薄型层压板A-stageresinA阶树脂B-stageresinB阶树脂C-stageresinC阶树脂epoxyresin环氧树脂phenolicresin酚醛树脂polyester

8、resin聚酯树脂polyimideresin聚酰亚胺树脂bismaleimide-triazineresin双马来酰亚胺三嗪树脂acrylicresin丙烯酸树脂melamineformaldehyderesin三聚氰胺甲醛树脂polyfunctionalepoxyresin多官能环氧树脂brominatedepoxyresin溴化环氧树脂epoxynovolac环氧酚醛fluroresin氟树脂siliconeresin硅树脂silane硅烷polymer聚合物amorphouspolyme