机顶盒芯片方案资料

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1、机顶盒芯片方案资料机顶盒硬件参数资料目录1.概要.............................................................................................................................................42.芯片方案.............................................................................................

2、........................................42.1.海思－Hi.........................................................................................................................42.1.1.Hi3109.................................................................................

3、................................42.1.2.Hi3110Q..............................................................................................................42.1.3.Hi3110E...............................................................................................

4、...............52.1.4.Hi3130.................................................................................................................52.1.5.Hi3560...............................................................................................................

5、..52.1.6.Hi3560Q..............................................................................................................52.1.7.Hi3570.................................................................................................................62.2.意法－ST...

6、.....................................................................................................................62.2.1.STi5189...............................................................................................................62.2.2.STi5197&STi5198.

7、.....................................................................................62.2.3.STi5197L............................................................................................................72.2.4.STi5202...........................................

8、....................................................................72.2.5.STi5512...............................................................