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ID:14184638
大小:51.00 KB
页数:7页
时间:2018-07-26
《材料英语证书考试(pec)-材料词汇解释》由会员上传分享,免费在线阅读,更多相关内容在行业资料-天天文库。
1、材料英语证书考试(PEC)-材料词汇解释Acceptor -Animpurityinasemiconductorwhichacceptselectronsexcitedfromthevalenceband,leadingtoholeconduction.ActiveSilayer -Siliconlayerontopoftheburiedoxide(BOX)inSOIsubstrates.Adhesion -Abilityofmaterialstostick(adhere)toeachother.Adhesionlayer -Materialus
2、edtoimproveadhesionofmaterials,typicallyphotoresisttothesubstrateinaphotolithographicprocesses.Somemetalsarealsousedtopromoteadhesionofsubsequentlayers.AmorphousSi,a-Si -Non-crystallinethin-filmsiliconhavingnolong-rangecrystallographyorder;inferiorelectricalcharacteristicsasc
3、omparedtosingle-crystalandpolySibutcheaperandeasiertomanufacture;usedprimarilytofabricatesolarcells.Angstrom,Å -Unitoflengthcommonlyusedinsemiconductorindustry,thoughitisnotrecognizedasastandardinternationalunit;1Å=10-8cm=10-4micrometer=0.1nm;thedimensionsofatypicalatoms.Anis
4、otropic -Exhibitingphysicalpropertiesindifferingcrystallographydirections.AnisotropicEtch -Aselectiveetchwhichexhibitsanacceleratedetchratealongspecificcrystallographydirections.Batchprocess -Processinwhichmanywafersareprocessedsimultaneously,asopposedtoasinglewaferprocess.Bi
5、polar -Semiconductordevicefabricationtechnologywhichproducestransistorsthatusebothholesandelectronsaschargecarriers.Boat -1.Adevicemadeofhighpuritytemperatureresistantmaterialssuchasfusedsilica,quartz,polySi,orSiCdesignedtoholdmanysemiconductorwafersduringthermalorotherproces
6、ses;2.devicedesignedtosimultaneouslycontainsourcematerialduringevaporationwhileatthesametimeheatingthesourcetoitsmeltingpoint;madeofhighlyconductive,temperature-resistantmaterialthroughwhichcurrentispassed.BondedSOI -SOIsubstrateformedbybondingtwosiliconwaferswithoxidizedsurf
7、acessuchthatonewaferisformedwithanoxidelayersandwichedbetweentwolayersofSi;onewaferissubsequentlypolisheddowntoaspecifiedthicknesstoformanactivelayerwheredeviceswillbefabricated.Boron -ElementfromgroupIIIoftheperiodictable;actsasanacceptorinsilicon;Boronistheonlyp-typedopantu
8、sedinsilicondevicemanufacturing.Bow -Concavity,curvature,ordeformati
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