资源描述:
《韩国科技公司英文简介模板companyprofile》由会员上传分享,免费在线阅读,更多相关内容在教育资源-天天文库。
1、“HighTechnologyforDisplayDevices”2006.07COMPANYPROFILEINDEXSEKWANGTECHNOLOGIESCO.,LTD2p6.DEALINGITEM6-1.MODULEASS’Y6-2.LCDASS’YMACHINE1.OFFICEANDADDRESS2.COMPANYPROFILE3.COMPANYHISTORY4.ORGANIZATION7.FACTORYAPPEARANCE8.LOCATION5.CERTIFICATION1.OFFICEANDADDRESS
2、SEKWANGTECHNOLOGIESCO.,LTD3pOFFICEADDRESSTELFAXMOBILEPHONEE-MAILHEADOFFICE&FACTORY351,BUKJUNGDONG,YANGSAN,KYUNGNAMKOREA82-55-372-3151~382-55-372-315482-11-9544-315182-11-877-5710sktech@sklcd.co.krBUNDANGOFFICE(SEOUL)8FMIDOPLAZABLDG,#158GEUMGOK-DONG,BUNDANG-GU,
3、SEONGNAM-SI,GYEONGGI-DOKOREA.82-31-713-571082-31-716-641682-11-323-4611blrnd@sklcd.co.krHONGKONGBRANCHROOM10,6F.,WAHSHINGIND.CENTRE,11-13SHINGYIPSTREET,KWUNTONG,KOWLOON,HONGKONG.852-2997-7176~8852-2997-7588852-9364-6338skhko@hkstar.comSHENZHENBRANCH(CHINA)86-7
4、55-2609-7641SUZHOUBRANCH(CHINA)YINGXIANGHUAYUAN3–1401ROOMXINGHAISTREETSUZHOUCHINA86-512-6763-42112.COMPANYPROFILESEKWANGTECHNOLOGIESCO.,LTD4p>COMPANYNAME:SekwangTechnologiesCo.,Ltd.>PRESIDENT:D.W.Kim(金東佑)>ESTABLISHMENT:20.JAN.1995>CORPORATIONREGISTEREDNo.:1845
5、11-0026557>EMPLOYEES:130>CAPITAL:USD800,000>ADDRESS:351,BukjungDong,Yangsan,Kyungnam,KoreaTEL)055-372-3151~3.FAX)055-372-3154E-MAIL)sktech@sklcd.co.kr>PLANTSIZE:1,691M²/SITEAREA:3,089M²(4FL)/FLOORAREA>MAINPRODUCT-LCDMODULEASS’YEQUIPMENTS/PANELEQUIPMENTS:Design
6、,Manufacturing&SalesForACF,FOG,COG,COF,TABBONDER,AUTOPOLATTACHM/C,ENDSEAL,COGINSPECTIONM/C,FPCCUTTINGM/C,INLINEAUTOCOG/FOGBONDINGM/C-LCDMODULEASSEMBLYPRODUCTS:Design,Assembling&SalesForBACKLIGHTMODULE3.COMPANYHISTORYSEKWANGTECHNOLOGIESCO.,LTD5p2006.OCT.Develop
7、edFPCCuttingM/COCT.DevelopedAutoPolAttachM/CJUL.DevelopedAutoTraceTester(3.5SEC)MAY.StarttoDevelopMiddlesize(3”~7”)COG+FOGbondingM/C(Tacttime3.9sec)(PlanedtofinishwithinOct.)StarttoDevelopautoPolattachM/C.(3.5sec)(PlanedtofinishwithinSep.)APR.StarttoDevelopsma
8、llsize(1”~4”)COG+FOGbondingM/C(Tacttime3.5sec)(PlanedtofinishwithinSep.)MAR.AcquiredISO14001:2004CertificateforLCDEquipment&LCDBLUassembly.2005.AUG.DevelopedSemiAutoCOFBondingM/C.(