pcb印制线路板术语中英对照简表

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1、本文由issac2005贡献xls文档可能在WAP端浏览体验不佳。建议您优先选择TXT，或下载源文件到本机查看。【印制线路板术语中英对照简表】印制线路板术语中英对照简表】排序英语AccelerateAgingAcceptanceQualityLevel(AQL)AcceptanceTestAccessHoleAnnularRingArtworkArtworkMaster简称加速老化ABackLight背光法BBaseMaterialBaseMaterialthicknessBlandViaBlisterBoardthicknessBondingLayerC-StagedResi

2、nChamfer(drill)CharacteristicImpendenceC-StagedResinChamfer(drill)基材CCharacteristicImpendenceCircuitCircuitCardCircuitryLayerCircumferentialSeparationCreakCreaseDateCodeDelaminationDeliveredPanel(DP)DentDesignspacingofConductive裂痕皱褶周期代码DDesmearDewettingDimensionedHoleDouble-SidePrintedBoard除

3、污缩锡双面板DrillbodylengthEEyeletFiberExposureFiducialMarkFlairFlammabilityRate燃性等级铆眼纤维暴露基准记号FlameResistantFFlareFlashoverFlexiblePrintedCircuit,FPCFlexuralStrengthFluteFluxGAPGerberData，GerBerFileGridGGroundPlane耐燃性扇形崩口闪络软板抗挠强度退屑槽阻焊剂格式档案标准格接地层GrandPlaneClearance接地层的空环HaloingHaywire也称JumperWire.H

4、eatSinkPlaneHipotTest即HighPostentialTestHHookHolebreakoutHolelocationHolepullStrength白圈散热层高压测试破孔孔位HoleVoidHotAirLevelingHybridIntegratedCircuitIcicleI.CSocketImageTransferImmersionPlatingImpendentImpendentControl破洞热风整平锡尖图象转移浸镀阻抗阻抗控制ImpendentMatchIInclusionIndexingHoleInspectionOverlayInsulat

5、ionResistance阻抗匹配底片IntermatallicCompound(IMC)介面合金共化物InternalStressIonizable（Ionic）ContaiminationIPCTheInstituteforInterconnectingandPackingElectronicCircuitJEDECJointElectronicDeviceEngineerCouncilJ-LeadJJumoerWireJust-In-Time(JIT)KeyingSlotKKissPressureKraftPaperLaminateLaminateVoidLandLand

6、lessHole无环通孔吻压牛皮纸基材板材空洞适时供应离子性污染LaserDirectImagingLDILLayBackLayOutLayUpLayertoLayerSpacingLeadMarginMarkingMaskMMountingHoleMultiwiringBoardNailHeadingNegativeEtchbakNegativePatternNNickNodleNominalCuredThicknessNonwettingOffsetOOverlapPinkringPlatedThroughHole,PTHPlatedPointPointAnglePPola

7、rizingSlotPorosityTestPostCurePrepregPress－FitContactPressPlateQQuadFlatPace(QFP）RackRegisterMarkReinforcement雷射直接成像刃角磨损排版引脚刃带安装孔复线板钉头负片粉红圈钻尖角偏槽后烤树脂片挂架加强物ResinRecessionResinContentRResinFlowReverseEtchedRinsingRobberRunoutScreenabilityScreenPrintin