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1、Transientliquidphasediffusionbondingof6061-15wt%SiCpinargonenvironmentJ.Maitya,∗,T.K.Palb,R.MaiticaDepartmentofMetallurgicalandMaterialsEngineering,NationalInstituteofTechnology,Durgapur,Durgapur713209,WestBengal,IndiabWeldingTechnologyCenter,DepartmentofMetallurgicalandMaterialEngineering,
2、JadavpurUniversity,Kolkata700032,WestBengal,IndiacCentralResearchFacility,IndianInstituteofTechnology,Kharagpur721302,WestBengal,IndiaAbstractExtruded6061-15wt%SiCpcompositewasjoinedbytransientliquidphasediffusion(TLPD)bondingprocessinargonenvironmentusing50-_mthickcopperfoilinterlayer.Theb
3、ondingwascarriedoutat560◦Cwithtwodifferentappliedpressures(0.1and0.2MPa)andfivedifferentholdingtimes(20min,1,2,3and6h).Kineticsofthebondingprocesswassignificantlyacceleratedinthepresenceofreinforcement(SiC).Thisaccelerationisattributedtotheincreasedsolutediffusivitythroughdefect-richSiCpart
4、icle/matrixinterfaceandporosity.Adequatebondstrength(90%oftheoriginalcompositestrength)wasachievedforbondingat0.2MPapressurewith6hofholding.Thisisveryclosetothereportedhighestbondstrengthachieved(92%oftheoriginalcompositestrength)forjoiningaluminium-basedmetalmatrixcompositebyTLPDprocessinv
5、acuumfollowedbyisostaticpressing.Therejectionofoxideatperipheryoncompletionofisothermalsolidification,andeliminationofvoidatbondinterfacethroughsolidstatediffusionathigherpressure(0.2MPa)werethemainreasonsofachievinghighbondstrength.Keywords:Transientliquidphasediffusion;Bonding;6061-SiCpco
6、mposite;Particlesegregation;Isothermalsolidification;Oxidation;Bondstrength氩气氛围中6061-15%(wt)SiCp的瞬时液相扩散连接J.Maitya,*,T.K.Palb,R.Maitica印度,西孟加拉邦,杜尔加布尔713209研究所,冶金与材料工程技术系;b印度,西孟加拉邦,加尔各答700032研究所,贾普达大学,冶金与材料工程系,焊接技术中心;c印度,西孟加拉邦,克勒格布尔721302研究所,印度理工学院,核心研究机构;摘要:在氩气氛围中通过液相扩散连接项目,用50um厚的铜箔层挤压6061-
7、15wt%SiCp复合材料使他们结合。在560℃,两种不同压力(0.1和0.2MPa)和五种不同保温时间(20min,1,2,3和6小时)下实施这次连接。增强相(SiC)的存在显著加快连接工艺的动力学问题。加速的原因在于SiC颗粒/基体界面的大量缺陷和气孔导致溶质的扩散加快。在0.2MPa,保温时间为6h情况下达到了充足的粘结强度(原始复合强度的90%)。这是非常接近于所报道过的,在真空等静压状态下依靠TLPD过程实现铝基金属基复合材料的连接获得的最高粘结强度(原始复合强度的92%)。隔绝氧化,在外围形