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ID:55753873
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时间:2020-06-05
《电子电路CAD上机考试-1.doc》由会员上传分享,免费在线阅读,更多相关内容在教育资源-天天文库。
1、电子电路CAD上机考试一画出如图所示的电路的原理图和PCB零件表DesignatorLibRefLibraryNameCommentFootprintC1CapMiscellaneousDevices.Intlib0.01uRAD-0.3C2Cap2MiscellaneousDevices.Intlib1uCAPR5-4X5C3Cap3MiscellaneousDevices.Intlib10uCAPR5-4X5D1,D2DiodeMiscellaneousDevices.IntlibIN4001DIODE-0.4
2、JP1Header2MiscellaneousConnectors.IntlibHeader2HDR1X2LS1SpeakerMiscellaneousDevices.IntlibSpeakerPIN2Q1NPNMiscellaneousDevices.Intlib2N2222ABCY-W3R1Res1MiscellaneousDevices.Intlib68KAXIAL-0.3R2Res1MiscellaneousDevices.Intlib270AXIAL-0.3R3Res1MiscellaneousDevic
3、es.Intlib47KAXIAL-0.3R4Res1MiscellaneousDevices.Intlib1MAXIAL-0.3R5Res1MiscellaneousDevices.Intlib10KAXIAL-0.3U1MM74HC04NNSCLogicGate.IntLibMM74HC04NDIP-14/D19.7评分标准:1画出原理图,并通过ERC检查(12分)2画出PCB图(双面板),并通过DRC检查(12分)3将双面板改为单面板,并通过DRC检查(4分)4所有线宽改为20mil(4分)二按要求画元件符号
4、与封装(8分)1、符号名称ZIP001,符号管脚长20mil,18个管脚,其它不限。2、元件封装为双列直插封装(DIP),名称DIP-18,封装焊盘长2.5mm(100mil)宽1.2mm(50mil),封装焊盘横向间距12.7mm(500mil),纵向间距2.5mm(100mil),其它不限。
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