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1、ElectrostaticDischarge(ESD)inThree-Dimensional Multi-StructuresDr.StevenHVoldmanIEEEFellowvoldman@ieee.orgIEEEColloquiumChengduChinaApril26-27th2012OutlineMulti-chipStructuresandtheParadigmShiftThreeDimensional(3-D)Structures-The“CUBE”-ThroughSiliconVias(TSV)ESDin3
2、-D-ESDIssues-ESDArchitecture-ESDResultsJEDECSpecificationsfortheFuture3DChipsIntroductionMulti-chipand3-Dstructureshavebeenagoalformanyyearsforimprovedbandwidth,densityandperformanceThreeDimensional(3-D)Structureshavebeendeveloped,butmorerecently,thereisasurgeofint
3、erest-Publications,PressRelease-SEMICONWest3DESDSeminarJuly2012-JEDEC,SEMATECHInvolvement3DIC/Chip&TSVInterconnectsMarket-GlobalForecast&TrendAnalysis(2011-2016)Technology(Substrate,BondingTechniques,ProcessRealization,Fabrication)Products(Memory,LED,Sensor,MEMS,Po
4、wer&AnalogComponents)Applications(MobileDevices,Processors,ICT,Networking,Automotive,Defense)3DMemory!2012-03-29Transparent3DmemorychipstoreplaceflashdrivesTransparent3Dmemorychipstoreplaceflashdrives2011-12-05IBM,Microntoproduce3DmemorychipsIBM,Microntoproduce3Dme
5、morychips2010-06-23Elpida,PTI,UMCpush3DICintegrationfor28nmElpida,PTI,UMCpush3DICintegrationfor28nm2008-12-22FlashmemoryreachesscalinglimitsFlashmemoryreachesscalinglimits2008-08-22USBmoduleusesSiP,3DtechnologyUSBmoduleusesSiP,3Dtechnology2008-08-13BeSangenablesfir
6、st3DICBeSangenablesfirst3DIC2008-07-14Specson3DchipstacksreleasedSpecson3Dchipstacksreleased2008-06-10IBMdemos3DchipcoolingIBMdemos3Dchipcooling3DMemory!2008-01-23GPUsuitshigh-endembeddedgraphicsappsAMDhasintroducedahigh-performanceGPUthatdeliversthelatest2D,3Dandm
7、ultimediagraphicsperformancetotheembeddedmarket.2007-06-14Toshiba'sNANDflashtechboostsdatacapacityToshiba'stechnologyinvolvesa3Dmemorycellarraystructurethatenhancescelldensityanddatacapacitywithoutrelyingonadvancesinprocesstechnology.2007-06-14Tezzarontakes3Dchippr
8、oductiontoCharteredTezzarontakes3DchipproductiontoChartered2007-04-11IBM,MayoClinicannounceadvancementsinimageregistrationMayoClinicandIBMCorp.ha
