EIAJ ED-4702A 2003 Mechanical strength testing methods

EIAJ ED-4702A 2003 Mechanical strength testing methods

ID:44017163

大小:451.15 KB

页数:49页

时间:2019-10-18

EIAJ ED-4702A 2003 Mechanical strength testing methods_第1页
EIAJ ED-4702A 2003 Mechanical strength testing methods_第2页
EIAJ ED-4702A 2003 Mechanical strength testing methods_第3页
EIAJ ED-4702A 2003 Mechanical strength testing methods_第4页
EIAJ ED-4702A 2003 Mechanical strength testing methods_第5页
资源描述:

《EIAJ ED-4702A 2003 Mechanical strength testing methods》由会员上传分享,免费在线阅读,更多相关内容在行业资料-天天文库

1、EIAJED-4702ACONTENTS1.Scope…………………………………………………………………………………………………………12.DefinitionofTerms……………………………………………………………………………………………13.NormativeReferences………………………………………………………………………………………34.Classification…………………………………………………………………………………………………35.GeneralConsideration………………………………………………………………………………………5

2、6.TESTMETHODS……………………………………………………………………………………………23TESTMETHODS001Temperaturecyclingtestaftermounting……………………………………23TESTMETHODS002Strengthtestsforsolderingjoint………………………………………………41TESTMETHODS003Bendingtestforsurfacemountdevicesontheboard……………………57TESTMETHODS004Reiterativebendingtestforsur

3、facemountdevicesontheboards……………………………………67TESTMETHODS005Droptestaftermounting………………………………………………………77Comments…………………………………………………………………………………………………………85EIAJED-4702AStandardofJapanElectronicsandInformationTechnologyIndustriesAssociationMechanicalstresstestmethodsforsemiconductorsurfacemoun

4、tingdevices1.ScopeThisstandardspecifiestheevaluationmethodofthemountboardofCSP/BGApackages,regardingthemechanicalstressesreceived,andalsoregardingthedurabilitytothermalstress,duringorafterthemountprocessofdiscretesemiconductordevicesandofintegratedcircuits(thebothdevices/circuitsarerefer

5、redtosemiconductordevicesinthisstandard)usedmainlyforindustrialandconsumeruseequipment.Note1.Thetestmethodspecifiedinthisstandardisanintegratedonebyincludingmountingmethods,kkNote1.mountingconditions,printedcircuitboards,solderingmaterials,andsooninthescopeofthetest.kkNote1.Itdosenotspec

6、ifytheevaluationmethodofanindividualsemiconductordevice.Note2.Mountingconditions,printedwiringboards,solderingmaterials,andsoonaffectsignificantlythekkNote1.resultofthetestspecifiedinthisstandard.Therefore,thetestspecifiedinthisstandardshallnotkkNote1.beregardedastheonetobeusedtoguarante

7、ethemountingreliabilityofsemiconductordevices.Note3.Thetestmethodisnotapplicablenornecessaryiftherearenostresses(mechanicalandotherkkNote1.stress)receiving,whicharesubjectineachtestinthisstandard.2.DefinitionofTermsThetermsanddifinitionbelow,aswellasthosedescribedinEIAJED

当前文档最多预览五页,下载文档查看全文

此文档下载收益归作者所有

当前文档最多预览五页,下载文档查看全文
温馨提示:
1. 部分包含数学公式或PPT动画的文件,查看预览时可能会显示错乱或异常,文件下载后无此问题,请放心下载。
2. 本文档由用户上传,版权归属用户,天天文库负责整理代发布。如果您对本文档版权有争议请及时联系客服。
3. 下载前请仔细阅读文档内容,确认文档内容符合您的需求后进行下载,若出现内容与标题不符可向本站投诉处理。
4. 下载文档时可能由于网络波动等原因无法下载或下载错误,付费完成后未能成功下载的用户请联系客服处理。