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ID:42655723
大小:451.16 KB
页数:68页
时间:2019-09-19
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1、1stlevelpackaging第•级封装2ndlevelpackaging第二级封装aberration象花/色左absorption吸收accelerationcolumn加速管acceptor受主Accumulatev・积聚.堆积acid酸acousticstreaming声学流activeregion有源区activate激活activateddopant激活杂质activecomponent有源器件adsorption吸附aerosol悬浮颗粒airionizer空气电离化器alignmentmark对准标记
2、alignment对准alloy合金alternateadj.交替的,轮流的.预备的v・交替,轮流,改变aluminum铝aluminumsubtractiveprocess铝刻蚀工艺ambient环境amnionia(NH3)氨气ammoniumfluondc(NH4F)氟化氨ammoniumhydroxide(NH4OH)氢氧化氨amorphous非晶的,无定型analog模拟信号angstrom埃anion阴离子anisotropicetchprofile各向异性刻蚀剖面anneal退火antimony(sb)僦a
3、ntirelectivecoating(ARC)抗反射涂层APCVD常压化学气向淀积applicationspecificIC(ASIC)专用集成电路aqueoussolution水溶液areaarray面阵列argon(Ar)n.
4、化]氤arsenic(As)碑arsine(AsH3)砕化氢,砕烷ashing灰化,去胶aspectratio深宽比,高宽比aspectratiodependentetching(ARDE)与刻蚀相关的深宽比asphyxiant窒息剂assaynumber检定数atmosphericadj.
5、大气的atmosphericpressure大气压atmosphericpressureCVTD(APCVD)常压化学气向淀积atomicforcemicroscopy(?VFM)原子力显微镜atomicnumber原子序数attemptn.努力,尝试,企图vt.尝试?企图augerelectronspectroscopy(AES)俄歇电子能谱仪autodoping自掺杂automaticdefectclassification(ADC)缺陷自动分类Bback-endoflinc(BE(儿)(生产线)后瑞工序backgr
6、ind减薄backingfilm背膜bafflevt困惑,阻碍.为难(挡片)baffleassemblyn.集合.装配.集会,集结,汇编(挡片块)ballgridarray(BGA)球栅阵列ballroomlayout舞厅式布局,超净间的布局barrelreactor圆桶型反应室barriermetal阻挡层金属barriervoltage势垒电压base基极,基区batch批bayandchaselayout生产区和技术夹层区beamblow-up离子束膨胀beamcurrent束流beamdeceleration束流
7、减速beamenergy离子束能呈beol(生产线)后瑞工序bestfocus最佳聚焦BGA球栅阵列Biasing电圧拉偏BICMOS双极CMOSbincodenumber分类代码号binmap分类图bipolarjunctiontransistor(BJT)双极晶体管bipolartechnology双极技术(工艺)bird'sbeakeffect鸟嘴效应blanketdeposition均号淀积blower增压泵boat舟BOE氧化层刻蚀缓冲剂Bonvoyage[法]再见,一路顺风I平安
8、bondingpads压点b
9、ondingwire焊线,引线boron(B)硼borontrichloridc(BCL3)三氯化硼borontrifluoride(BF3)三氟化硼borophosphosilicateglass(BPSG)硼磷硅玻璃borosilicateglass(BSG)硼硅玻璃bottomantircflcctivccoating(BARC)下减反射涂层boule单晶锭bracketn.墙上凸出的托架,括弧,支架v.括在一起breakthroughstep突破步骤,起始的干法刻蚀步骤brightfielddetection亮场
10、检杳brushscrubbing涮洗bubbler带鼓泡槽bufferedoxideetch(BOE)氧化层腐蚀缓冲液bulkchemicaldistribution批鼠化学材料配送bulkgases大批气体bulkheadequipmentlayout穿壁式设备布局bumpedchip凸点式芯片buriedlaye
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