生益板料Data_sheet

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1、广东生益科技股份有限公司GUANGDONGSHENGYISCI.TECHS1000(ANSI:FR-4)UVBlocking特点应用领域!UVBlocking和AOI兼容。!实现了比普通FR-4降低约30～35％的Z轴热膨胀系电脑、仪器仪表、摄像机、通讯设备、汽车、电子游戏机等。数，有着优良的通孔可靠性。!优良的耐热性：T260>30min，T288>5min，适合于无铅焊工艺。!优异的CAF和Q1000性能。!优良的尺寸稳定性。!优秀的机械性能和电性能。!Tg(DSC)155℃。FEATURESAPPLICATIONS!UVBlo

2、ckingandAOIcompatible.Computer,Instrumentation,VCR,!Approximately30~35%lesscoeffeicientofCommunicationequipment,thermalexpansionintheZ-axislies.Automabileelectronics,!Goodsolderingreliability:T260>30min,Electronicgamemachine,etc.T280>5min,sutibaleforlead-freeprocess.!S

3、uperiorCAFandQ1000performance.!Gooddimensionalstability.!Excellentmechanicalandelectricalproperties.!Tg(DSC)155℃.GENERALPROPERTIESPropertyDataTestItemTreatmentConditionUnitSPECTypicalValueTgDSC℃≥145155C-48/23/50Flammability-V-0V-0E-24/12568Aftermoistureresistance≥107.3

4、7×10VolumeResistivityMΩ-cm37E-24/125≥105.63×1047Aftermoistureresistance≥107.63×10SurfaceResistivityMΩ37E-24/125≥102.83×10ArcResistanceD-48/50+D-0.5/23S≥60147DielectricBreakdownD-48/50+D-0.5/23KV≥4045DielectricConstant-C-24/23/50≤5.44.7(1MHz)DissipationFactor-0.011(1MHz

5、)C-24/23/50≤0.035ThermalUnetched288℃,20s-NodelaminationNodelaminationStressEtchedPeel1oz288℃,10s≥1.051.4N/mmStrengthCu.Foil125℃≥0.701.2FlexuralLW≥415450AMPaStrengthCW≥345380WaterAbsorptionD-24/23%≤0.350.09CTEBeforeTgTMAμm/m℃-40Z-axisAfterTgTMAμm/m℃-21030~260℃TMAμm/m℃-1

6、30SpecimenThickness:1.6mmExplanations:C=Humidityconditioning;D=Immersionconditioningindistilledwater;E=Temperatureconditioning.Thefiguresfollowingthelettersymbolsindicatewiththefirstdigitthedurationofthepreconditioninginhours,withtheseconddigitthepreconditioningtempera

7、turein℃andwiththethirddigittherelativehumidity.-1-GUANGDONGSHENGYISCI.TECHS1000BPREPREG(ANSI:FR-4)BondingPrepregForS1000特点FEATURES!高Tg155℃,有优异的耐热性。!HighTg155℃andgoodthermalshockingperformance.!优良的耐化学性能。!Excellentchemicalresistance.!良好的粘合性能与PCB可加工性能。!Goodadhesionpropert

8、yandPCBproductivity.!UVBlocking与AOI兼容。!UVBlockingandAOIcompatible.PREPREGPARAMETERSGlassfabricGeltimeResincontentResi