igbt功率模块热传导与退化研究

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1、·transitionmodule.Monitorthemodule-junctiontemperatureinreal-timebymeansoffibertemperaturesensor.TheTeckhigh-speedmemoryoscillographisadoptedtorecordthecollector-emittervoltageandcollectorcurrentwaveforminswitchingprocess.Designtheorthogonalexperimentwhichincludesfourcurrentlevel

2、sandfourfrequencylevels,andanalyzethethermalelectricparametersaswellastemperaturedata.Inaddition,threedimensionalsteadystateandtransientofIGBTmodulesaresimulatedbyANSYSwiththemeasuredaveragepowerlossasheatsourceandthenthetemperaturefielddistribution,junctiontemperatureandshelltem

3、peraturecurveofmodulecanbeobtained.Themeasuredcasetemperaturecurvesarecomparedwiththesimulationcurvetoverifytheconsistencyoftestresultsandtheresultsofsimulation.Finally,thenetworkmodelandtestmethodofthermalresistancearestudied,andthethermalresistanceparameterswhichbasedonthemeasu

4、redpowerloss,junctiontemperatureandshelltemperatureareextracted.ThefatiguestateofIGBTmodelisquantitativeevaluated,whichisbasedonthefuzzyregressionmodelH(R).KEYWORDS:IGBTmoduleJunctiontemperatureThermalresistanceFuzzyregressionmodelIV···目录第一章绪论.....................................

5、...............................................................................-1-1.1研究背景与意义.........................................................................................................-1-1.2国内外现状与发展趋势...................................................................

6、..........................-4-1.2.1IGBT温热测试技术的发展现状......................................................................-4-1.2.2IGBT模块退化状态评估的研究现状..............................................................-9-1.3主要研究内容..............................................................

7、..............................................-10-第二章IGBT模块热传导及退化的理论分析.............................................................-11-2.1IGBT模块传热机理分析...........................................................................................-11-2.1.1IGBT模块热传导分析...................

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