单片机课程设计报告万年历

单片机课程设计报告万年历

ID:67617648

大小:5.65 MB

页数:65页

时间:2021-10-14

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1、.-目录一、摘要·········································································2二、设计任务.····································································4三、总体方案设计与论证···························································41、液晶显示模块···················

2、··········································42、实时时间计算模块·························································53、实时环境温度采集模块·····················································54、报警模块······························································65、设置模块····

3、··························································6四、总体方案组成框图··························································7五、系统硬件设计·····························································81、LCD显示模块·················································

4、·········82、实时时间计算模块······················································123、实时环境温度检测模块.可修编..-·················································164、报警模块·····························································215、设置模块···································

5、··························22六、系统软件设计····························································23七、系统硬件电路设计························································24八、系统硬件PROTEUS仿真原理图············································25九、系统硬件仿真运行情况图·············

6、·····································261、显示欢送界面·························································262、显示实时时间··························································263、显示当前温度··························································274、时间设置········

7、······················································275、最高报警温度设置······················································286、闹钟时间设置··························································287、超温······························································

8、····298、闹钟时间到····························································29.可修编..-附录一:实物图······························································30附录二:PCB图···············································

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