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时间:2019-10-20
《超高压SiC功率(电力电子)器件》由会员上传分享,免费在线阅读,更多相关内容在工程资料-天天文库。
1、超高压SiC功率(电力电子)器件(1)超高压SiC功率(电力电子)器件本次TCSCRM2011国际会议的最后一天,一个重要的讨论内容集中在超高压SiC功率(电力电子)器件方面。所谓超高压器件是指电压大于6500V的功率器件,其电流处理能力达到50Ao目前传统的Si基双极型功率器件包括:1GBT、GTO、Thyristor、IGCT和ET0,这些器件面临的主要问题是:(1)开关速度低,(2)器件结温低,(3)并联性能差,(4)缺乏栅极控制能力,(5)重复恢复吋间(tq)长,(6)额定电压理论上限(~10kV)低,等,其具体
2、电压等级分别为:(1)Thyristor:9000V,(2)GTO:8000V,(3)IGBT:6500V,(4)MOSFET、SBD:~100-200V。高压应用领域包括:(1)utilitygrid,(2)pulsedpower,(3)futureelectromagneticweapon,(4)protectionsystem,(5)veryhighvoltageswithesforHVDCpowertransmission,(6)windturbing,(7)powersustations,(8)Hightemp
3、erature。SiC功率半导体器件依其优势材料为基础,可开发出与Si功率器件结构类似但突破Si基电压极限的功率器件,如Thyristor、IGBT、GTO等,且具有正向电压低、数KHz开关频率、易于并联的性质。该类器件的研发主要集中在美国研发单位或机构,如位于美国V让ginia州的GeneSiC半导体公司、位于美国NC州的Cree公司、位于美国NY州的S订icon电力公司、位于美国MD州的NRL海军研究实验室、位于美国町州的Rutgers大学等。(2)SiCThyristor晶闸管器件GeneSiC半导体公司WWW<)
4、WEJno&□
5、$IThyrtrtor.2$CISIThrteeorUSCThyrMorlSOC<)・UEJno4kVSiThyrntor8.3mO6、tha4kVSiThyristor(2)On~stateT"Vcharacteristicsof1arge_area77mm2and28mm26.5kVSiCThyristors.(2)Comparisonof25°Con-statecharacteristicsofGeneSiC"sSiCThyristorwitha4kVSiThyristor.(3)On-statevoltagedropcomparisonbetweenSiliconandSiCbipolardevicesforvariousutilityvolta7、ges.(1)12kVlcm2SiCGTO晶闸管——Cree公司TheSiCGTOofferssignificantadvantagesoveraSiGTOduetothelargebreakdownfieldandhightemperaturecapabilityofSiC.Thehighervoltageratingrequiresathickerdriftlayer.ThelowminoritylifetimecurrentlyinSiCnecessitatestheuseofminimumthicknessoft8、hevoltageblockinglaycr9、asgrownwithadopingof<2X1014cm-3.Followingthiswasthen-typcbaselayer,dopedat^1X1017cm-3withthicknessof2.5um.12kVSiCGTOswithachipsizeof1cmX1cmandwithwidthof600pmn
6、tha4kVSiThyristor(2)On~stateT"Vcharacteristicsof1arge_area77mm2and28mm26.5kVSiCThyristors.(2)Comparisonof25°Con-statecharacteristicsofGeneSiC"sSiCThyristorwitha4kVSiThyristor.(3)On-statevoltagedropcomparisonbetweenSiliconandSiCbipolardevicesforvariousutilityvolta
7、ges.(1)12kVlcm2SiCGTO晶闸管——Cree公司TheSiCGTOofferssignificantadvantagesoveraSiGTOduetothelargebreakdownfieldandhightemperaturecapabilityofSiC.Thehighervoltageratingrequiresathickerdriftlayer.ThelowminoritylifetimecurrentlyinSiCnecessitatestheuseofminimumthicknessoft
8、hevoltageblockinglaycr9、asgrownwithadopingof<2X1014cm-3.Followingthiswasthen-typcbaselayer,dopedat^1X1017cm-3withthicknessof2.5um.12kVSiCGTOswithachipsizeof1cmX1cmandwithwidthof600pmn
9、asgrownwithadopingof<2X1014cm-3.Followingthiswasthen-typcbaselayer,dopedat^1X1017cm-3withthicknessof2.5um.12kVSiCGTOswithachipsizeof1cmX1cmandwithwidthof600pmn
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