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1、IonImplanterIntroductionDiffusionVSImplantationWhatisIonImplantForimpuritydopecontrolinfabricationofsiliconcircuitordevicePreciselycontrolimpuritydopingandprofileLowTemperatureOperationOtherImplantProfileandActiveImplantProfileImplantandActive氣體的平均自由動徑氣體的
2、平均自由動徑(λ)定義為平均一個粒子在碰撞其他粒子前所走的距離。λ=2.33x10-20T/Pd02(cm)(d0:分子直徑)在室溫時,平均自由徑與壓力間關係λ=5x10-3/P(cm)(p:torr)以25∘C之空氣,在10-3torr條件下λ=5x10-3/1x10-3=5(cm)SystemOverviewIonsourceExtractionRegionAnalyzingMagnetRegionQuadrapoleandBeamFocusScanSystemBeamMonitorandDosime
3、terNeutralizingSystemSystemSpeciesP+dopantB:Boron(B2H6,BF3)In:Indium(InCl,InO3)N+dopantP:Phosphorus(PH3,P2O5)As:Arsenic(AsH3,As2O3)OthersSi:Silicon(SiH4)Ge:Germanium(GeH4)IonSourceDCDischargeFreemantypeBernastypeBuckettypeRFDischargeICPFreemantypeIonSourc
4、e-ParametersGasFlow--highgasflowresultinginhigharcingrate,highcondensationrate,highcostandpoorvacuum.ArcVoltage--theelectronsenergytoionizeatomandtheenergythepositiveionimpactthefilament.Higherarcvoltage,higherbeamIandshortsourcelifetime.Filament--SourceM
5、agnet--BernastypeBernastype-pictureBuckettypeRPICPTypeBF3IonizationSpeciesPH3IonizationSpeciesRFIonizationSpeciesB2H6→BHx++B2Hx++Hx+(mainB2Hx+)PH3→PHx++P2Hx++Hx+(mainPHx+)P2Hx/PHx<10%ExtractionRegionExtractionRegionIIElectricalFieldBeamCurrentAnalyzingMag
6、netRegionMassResolutionBeamQualityMassResolutionX:M/ΔM≧10Y:M/ΔM≧2BPcrosscontaminationX:PM(31),range[29.4,32.6]BM(11),range[10.4,12.6]Y:PM(31),range[23.3,37.7]BM(11),range[7.75,14.25]BF+P+QuadrapoleandBeamFocusFocus&UniformityControlScanSystemIVerticalSc
7、anSystemIIHorizontalScansystemIIISteepSlopeBeamMonitorDosimeterNeutralizingSystemSpaceChargeNeutralizationProcessConceptHotCarrierEffectChannelEffectChargingEffectPressureandOutgassingCoolingHotcarrierEffectHotcarriereffectsaremoresevereinn-channeltransis
8、torsduetothehigherimpactionizationrateofelectronsvs.holesHotCarrierEffectSolutionLDD(LightDopedDrain)2.LowerVdsChannelEffectchanneleffectcanresultsinpoordopingprofileanddepthcontrol,aswellasjunctiondepthshiftChannel